COM Express Type 6 Basic module with Intel® Xeon® Processor E3-1258L v4 Quad Core CPU with 1.8GHz, 47W, GT2 Graphics
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conga-TS97 (EOL)
COM Express® Type6 module based on 5th Generation Intel® Core i7 quad core processor and Intel® Xeon® E3-12xx processors
- Procesador de cuatro núcleos Intel® Core™ i7 de quinta generación y procesadores Intel® Xeon® E3-12xx.
- Hasta gráficos Intel® Iris™ Pro P6300
- 3 DisplayPort 1.2, hasta 4k de resolución
- Intel® AVX 2.0 Vector extension for improved floating point computing
Specification
with OpenCL 1.2, OpenGL 4.0 and DirectX11.1 support; up to three independent displays: DDI, DVI, DP, VGA
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Data Sheet
Manual
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
COM Express Type 6 Basic module with Intel® Xeon® Processor E3-1278L v4 Quad Core CPU with 2.0GHz, 47W, GT3 Graphics
COM Express Type 6 Basic module with Intel® Core™ i7-5700EQ Processor Quad Core CPU with 2.6GHz, 47W, GT2 Graphics
COM Express Type 6 Basic module with Intel® Core™ i7-5850EQ Processor Quad Core CPU with 2.7GHz, 47W, GT3 Graphics
Ecosystem Details
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Cooling Solutions
Standard passive cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm threaded
Standard passive cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7 mm bore hole
Standard active cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded
Standard active cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
Standard heatspreader for high performance COM Express module conga-TS87 and TS97 with flat heat pipes. All standoffs are M2.5mm threaded
Standard heatspreader for high performance COM Express module conga-TS87 and TS97 with flat heat pipes. All standoffs are with 2.7mm bore hole
Memory
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM, 1,35V &1,5V memory module with 1600 MT/s and 16GB RAM
Accessories
conga-LDVI
Módulo convertidor a DVI para LVDS
conga-TEVAL/COMe 2.1 (EOL)
Placa base de evaluación para módulos COM Express® Tipo 6