conga-TS97/E3-1258LV4 (P/N 046833)
COM Express Type 6 Basic module with Intel® Xeon® Processor E3-1258L v4 Quad Core CPU with 1.8GHz, 47W, GT2 Graphics
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conga-TS97 (EOL)
COM Express® Type6 module based on 5th Generation Intel® Core i7 quad core processor and Intel® Xeon® E3-12xx processors
Selected module variant
Selected ecosystem parts
Carrierboards
Cooling Solutions
Memory
Value adding ecosystem offerings
Carrierboards
Cooling Solutions
Memory
conga-TS97 (EOL)
COM Express® Type6 module based on 5th Generation Intel® Core i7 quad core processor and Intel® Xeon® E3-12xx processors
- 5th Gen. Intel® Core™ i7 quad core processor and Intel® Xeon® E3-12xx processors
- Up to Intel® Iris™ Pro Graphics P6300
- 3x DisplayPort 1.2, up to 4k resolution
- Intel® AVX 2.0 Vector extension for improved floating point computing
Specification
Formfactor
COM Express Basic
CPU
Intel® Xeon® E3-1278LV4
(4 x 2.0 GHz, 6MB cache, 47W)
Intel® Xeon® E3-1258LV4
(4 x 1.8 GHz, 6MB cache, 47W)
Intel® Core™ i7-5850EQ
(4 x 2.7 GHz, 6MB cache, 47W)
Intel® Core™ i7-5700EQ
(4 x 2.6 GHz, 6MB cache, 47W)
DRAM
2 Sockets, SO-DIMM DDR3L@1.35V up to 1600MT/s and 32GByte
Ethernet
Intel® I218-LM GbE LAN Controller with AMT 10 support
I/O Interfaces
7 x PCI Express™
4 x SATA
2 x Express Card®
4 x USB 3.0
8 x USB 2.0
LPC bus
I²C bus
1 x PEG
Graphics
Intel® HD Graphics
with OpenCL 1.2, OpenGL 4.0 and DirectX11.1 support; up to three independent displays: DDI, DVI, DP, VGA
with OpenCL 1.2, OpenGL 4.0 and DirectX11.1 support; up to three independent displays: DDI, DVI, DP, VGA
congatec Board Controller
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup, Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
embedded BIOS Features
AMI Aptio UEFI
8/16 MByte serial SPI firmware flash
Security
The conga-TS97 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0).
Power Management
ACPI 4.0 with battery support, Intel AMT 9.1 Support
Temperature
Standard
Operating: 0 to +60°C Storage: -20 to +80°C
Operating: 0 to +60°C Storage: -20 to +80°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
3 x DDI / DisplayPort 1.2a with support for Multi-Stream Transport (MST), resolutions up to 4k
Size
95 x 125 mm (3.74" x 4.92")
Documents
All documents found on this page are updated without notification. Always check this page for
the latest
version.
Data Sheet
13.07.2015
Manual
10.09.2015
11.11.2015
15.06.2015
Product Variants
conga-TS97/E3-1278LV4 (P/N 046832)
COM Express Type 6 Basic module with Intel® Xeon® Processor E3-1278L v4 Quad Core CPU with 2.0GHz, 47W, GT3 Graphics
conga-TS97/i7-5700EQ (P/N 046831)
COM Express Type 6 Basic module with Intel® Core™ i7-5700EQ Processor Quad Core CPU with 2.6GHz, 47W, GT2 Graphics
conga-TS97/i7-5850EQ (P/N 046830)
COM Express Type 6 Basic module with Intel® Core™ i7-5850EQ Processor Quad Core CPU with 2.7GHz, 47W, GT3 Graphics
Ecosystem Details
Carrierboards
conga-TEVAL (P/N 065800)
Evaluation Carrier Board for COM Express Type 6 Modules.
Cooling Solutions
conga-TS87/CSP-FP-T (P/N 046856)
Standard passive cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm threaded
conga-TS87/CSP-FP-B (P/N 046855)
Standard passive cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7 mm bore hole
conga-TS87/CSA-FP-T (P/N 046854)
Standard active cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded
conga-TS87/CSA-FP-B (P/N 046853)
Standard active cooling solution for high performance COM Express module conga-TS87 and TS97 with flat heat pipes | 15mm fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
conga-TS87/HSP-FP-T (P/N 046852)
Standard heatspreader for high performance COM Express module conga-TS87 and TS97 with flat heat pipes. All standoffs are M2.5mm threaded
conga-TS87/HSP-FP-B (P/N 046851)
Standard heatspreader for high performance COM Express module conga-TS87 and TS97 with flat heat pipes. All standoffs are with 2.7mm bore hole
Memory
DDR3L-SODIMM-1600 (2GB) (P/N 068755)
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
DDR3L-SODIMM-1600 (8GB) (P/N 068757)
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L-SODIMM-1600 (4GB) (P/N 068756)
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L-SODIMM-1600 (16GB) (P/N 068758)
DDR3L SODIMM, 1,35V &1,5V memory module with 1600 MT/s and 16GB RAM
Accessories
conga-LDVI
DVI Converter Module for LVDS
conga-TEVAL/COMe 2.1 (EOL)
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 2.1
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