Your item has been added to the inquiry
conga-BM67 (EOL)
Módulo COM Express™ Básico, Tipo 2, basado en la familia de procesadores Intel® Core™ de segunda generación
- Módulo COM Express Básico, Tipo 2, de alto rendimiento
- Hasta procesador Intel® Core™ i7 de cuatro núcleos
- Soluciones de refrigeración basadas en tubos de calor
Specification
Intel® Ethernet PHY with AMT support
Processor integrated Mobile Intel® 6 Series HD graphics, OpenGL 3.0 and DirectX 10.1 support, Two independent pipelines for full dual view support, High performance hardware MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 Mbit/s, hardware motion compensation, no PEG support
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Other
Application Note
Manual
Image
Data Sheet
Software
Product Variants
Ecosystem Details
Cooling Solutions
Standard active cooling solution for high performance COM Express module conga-BM67 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-BM67 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Standard heatspreader for high performance COM Express module conga-BM67 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-BM67 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express module conga-BM67 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-BM67 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Accessories
conga-CKIT (EOL)
Este kit completo permite iniciar inmediatamente la evaluación de los módulos COM Express™ Tipo 2.
conga-CEVAL (EOL)
Placa base de evaluación para módulos COM Express®, con definición de patillaje tipo 2
conga-Cdebug (EOL)
Plataforma de depuración COM Express® para módulos tipo 2 y placas base
conga-FPA2 (EOL)
Placa adaptadora universal para pantallas planas
conga-LDVI
Módulo convertidor a DVI para LVDS