COM-HPC Mini Ecosystem

Upcoming high-performance standard in a nearly credit-card sized form factor

Our upcoming COM-HPC Mini ecosystem offers extraordinary performance and I/O density for space- and power-restricted applications. Target use cases can be found in all next-generation high-end embedded systems, including embedded vision for which it also offers two MIPI-CSI interfaces.
 

Learn more about COM-HPC Mini

 

More about conga-HPC/mPTL

conga-HPC/mPTL

  • Intel® performance hybrid design with up to 16 cores
  • Integrated NPU for dedicated AI acceleration
  • Onboard LPDDR5x with in-band ECC on selected
  • product variants Onboard NVMe SSD with 128GB
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More about conga-HPC/mIQ-X

conga-HPC/mIQ-X

  • Qualcomm® Dragonwing IQ-X processors
  • Up to 12 Oryon™ CPU cores
  • Hexagon™ NPU with 45 TOPS
  • Up to 64 GB LPDDR5x
  • Industrial Temp. Range
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More about conga-HPC/mRLP

conga-HPC/mRLP

  • 13th Generation Intel® Core™
  • Intel® Xe graphics engine
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4
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More about conga-HPC/3.5-Mini

conga-HPC/3.5-Mini

  • Compact Application Carrier for COM-HPC Mini Modules
  • Scalable 3.5” motherboard
  • Longevity by module concept
  • Quick start for COM-HPC Mini designs
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More about conga-HPC/EVAL-Mini

conga-HPC/EVAL-Mini

  • Evaluation Carrier for COM-HPC Mini Modules
  • Routing of the entire signals provided by COM HPC Module Base Specification to standard interface connectors
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