Ruggedize your High-performance
egde server design
COM-HPC and COM Express modules with
Intel Xeon D processors
Unlimited freedom for edge servers with Server-on-Modules based on Intel Xeon D processors
COM-HPC Server enables the data center to move out of its protected environment into the harsh, custom edge world. With the introduction of Intel Xeon D processors on COM-HPC server-on modules from manufacturers such as congatec, edge server installations can for the first time break free from the constraints of the tight thermal restrictions of air-conditioned server rooms and can finally be installed anywhere where massive data throughput is required with the lowest possible latencies - right up to deterministic real time.
With edge server computing, data is processed at the edge of the communications network instead of in central clouds, in order to enable delay-free or real-time interaction with clients of all kinds. However, this poses major challenges for manufacturers of server, networking and storage technologies. This, however, presents manufacturers of server, networking and storage technologies with major challenges, because up to now they have generally been accustomed to developing standardized rack solutions for their systems, In the past, they were used to developing standardized rack solutions for their systems, in which the thermal management of the racks and the air conditioning of the server rooms were controlled by active ventilation concepts and high-performance air conditioning technology. In many cases, such approaches are no longer suitable for edge server technology and the COM-HPC server standard is the new solution.
The key features
Overview
- COM-HPC Server-on-Modules for extreme edge conditions
- Follow-on platform to Broadwell-DE
- Optimized for IoT applications
- Industrial use condition & 10+ year product availability
- Extended temperature SKU offerings
- Accelerate the next generation of real-time microserver workloads in rugged environments
Enhanced Features
- Up to 20 cores
- Offering low to high power SKUs (35W – 118W TDP)
- Up to 32 PCIe 4.0 + 16 HSIO PCIe 3.0
- Up to 100Gb Ethernet throughput
- TCC/TSN support
- AI applications benefit from accelerated data analytics such as AVX-512 and VNNI
- Enhanced security (Intel Boot Guard, Intel Total Memory Encryption, Intel Software Guard Extensions)
Target applications
- Automation robotics
- Medical backend imaging
- Smart grids for oil, gas and electricity
- Communication networks like 5G Base-Stations
- Vision enabled applications such as autonomous vehicles and video surveillance infrastructures
The modules
Videos
COM-HPC & COM Express Server-on-Modules based on Intel® Xeon D processors | Ice Lake
New Server-on-Modules based on Intel® Xeon D processors (Ice Lake) | conga technology talk
congatec celebrates the world premiere for x86 based COM-HPC Server modules by announcing the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D. The new COM-HPC Server modules in Size E and Size D as well as the COM Express Type 7 modules will accelerate the next generation of real-time microserver workloads in rugged environments and extended temperature ranges. Improvements include up to 20 cores, RAM to up to 1 TB, double throughput per PCIe lanes to Gen 4 speed, as well as up to 100 GbE connectivity and TCC/TSN support. Target applications range from industrial workload consolidation servers for automation, robotics and medical backend imaging to outdoor servers for utilities and critical infrastructures – such as smart grids for oil, gas and electricity as well as rail and communication networks – and also includes vision enabled applications such as autonomous vehicles and video infrastructures for safety and security.
Ecosystem
The congatec offering is not limited to Computer-On-Modules and Server-On-Modules only. A complete ecosystem to allow for a rapid development start is available for COM-HPC Client, COM-HPC Server, COM Express Type 6, 7 & 10 and for SMARC modules.
Contents of the congatec ecosystem include:
- Evaluation carrier boards including schematics and further design details to allow for a rapid application development start
- Ethernet mezzanine cards for flexible 25G Ethernet implementations on COM-HPC
- Flexible cooling solutions for all kind of system coolings:
►Heatspreaders as defined in the according module specifications
►Passive cooling solutions which require some airflow from the system
►Active cooling solutions with integrated high reliable fans
►Heatpipe adapters to allow for high performance passive cooled systems - Tested DRAM modules for highest reliability – also for industrial operation temperature ranges
Learn more about COM-HPC
COM HPC Server – the new Server-on-Module standard
What are the most important markets and applications for the new high-end Server-on-Modules and what are the limits?
COM-HPC carrier board designs
COM-HPC is the upcoming new standard for modular high-end edge servers. It provides significantly faster and almost twice as many interfaces as COM Express. As a result, carrier board design requirements are increasing exponentially. How can developers prepare for the new challenges?
