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conga-TC1000r

COM Express Type 6 Compact rugged module based on Intel Core Ultra Series 3 (Panther Lake) with LPCAMM2 memory

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                conga-TC1000r

                COM Express Type 6 Compact rugged module based on Intel Core Ultra Series 3 (Panther Lake) with LPCAMM2 memory

                Learn all about COMs - download the guide

                • Intel® performance hybrid architecture with up to 16 cores
                • Intel® Arc™ Graphics or Intel Graphics
                • Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance
                • LPCAMM2 LPDDR5 memory with up to 96 GB RAM system capacity 
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                Value adding ecosystem offerings

                Virtualization

                Operating Systems

                IOT Software

                Cooling Solutions

                Carrierboards

                Module services

                Specification

                Formfactor
                COM Express Compact
                CPU
                Intel® Core™ Ultra X9 388H (16 x 5.1 GHz, 18MB cache, 25W)
                Intel® Core™ Ultra 5 325 (8 x 4.5 GHz, 12MB cache, 25W)
                Intel® Core™ Ultra 7 356H (16 x 4.7 GHz, 18MB cache, 25W)
                Intel® Core™ Ultra 9 386H (16 x 4.9 GHz, 18MB cache, 25W)
                DRAM
                Up to 96GB LPCAMM2 memory based on LPDDR5x with up 8533 MT/s | In-band ECC (only on selected product variants)
                Ethernet
                2.5 GbE via Intel® i226 Ethernet controller series | Supporting TSN – Time Sensitive Networking (depending on PN) | Software Definable Pin (SDP) to be used for IEEE 1588
                I/O Interfaces
                Up to 12x PCIe Gen4 PEG (H484) or up to 4x PCIe Gen4 PEG (H12Xe, H404)
                up to 8x PCIe Gen4
                up to 2x USB4
                2 x USB 3.2
                8 x USB 2.0
                2 x SATA
                2 x UART (RX/TX only)
                GPIO
                GPSPI
                LPC
                SM-Bus
                I²C
                Mass storage
                NVMe x4 up to 1 TB capacity SSD (optional)
                Graphics
                Intel® Arc Graphics with up to 12 Xe cores or Intel Graphics with up to 4 Xe cores | Intel® Xe Matrix Extensions
                NPU/AI Acceleration
                Integrated NPU accelerator 50 TOPS | Up to 180 TOPS platform total
                congatec Board Controller
                Module Management Controller | Multistage Watchdog | Board Information | Board Statistics | I²C bus (fast mode) | Power Loss Control | Hardware Health Monitoring | POST Code Redirection
                embedded BIOS Features
                AMI Aptio® UEFI firmware
                OEM Logo
                OEM CMOS Defaults
                LCD Control
                Display Auto Detection
                Backlight Control
                Security
                Trusted Platform Module (TPM 2.0)
                Power Management
                ACPI 6.0 | wide range power supply 8.5V – 20V | single supply power
                Operating Systems
                Microsoft® Windows 11 IoT Enterprise
                Microsoft® Windows 11
                Linux
                Hypervisor
                RTS Real-Time Hypervisor
                Temperature
                Commercial variants: Operation: 0° to +60°C | Storage: -20° to +80°C
                Industrial variants: Operation: -40° to +85°C | Storage: -40° to +85°C
                Humidity
                Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
                Video Interfaces
                Up to 3x DDI (2x shared with USB4)
                LVDS or eDP
                4 x independent displays up to 8k
                Features
                Staged Watchdog
                Size
                95 x 95 mm (3,74" x 3,74")

                Documents

                All documents found on this page are updated without notification. Always check this page for the latest version.

                Data Sheet

                Data Sheet for conga-TC1000r
                18.12.2025

                Whitepaper

                The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

                Product Variants

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                  There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
                  If you don't find the configuration you require contact your congatec Sales representative for further assistance.
                  conga-TC1000r/ultraX9-388H-32G (P/N 052100)

                  COM Express Compact module based on Intel® Core Ultra X9 388H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel® Arc B390 Graphics with 12Xe cores | LPCAMM LPDDR5 memory module with up to 8533 MT/s and up to 32 GB system memory capacity | commercial grade temperature range from 0°C to 60°C.

                  conga-TC1000r/ultra9-386H-32G (P/N 052101)

                  COM Express Compact module based on Intel® Core Ultra 9 386H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | LPCAMM LPDDR5 memory module with up to 8533 MT/s and up to 32 GB system memory capacity | commercial grade temperature range from 0°C to 60°C.

                  conga-TC1000r/ultra7-356H-16G (P/N 052103)

                  COM Express Compact module based on Intel® Core Ultra 7 356H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | LPCAMM LPDDR5 memory module with up to 8533 MT/s and up to 16 GB system memory capacity | commercial grade temperature range from 0°C to 60°C.

                  conga-TC1000r/ultra5-325-16G (P/N 052106)

                  COM Express Compact module based on Intel® Core Ultra 5 325 processor with 4 P-cores and 4 LPE-cores | Integrated NPU | 12MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | LPCAMM LPDDR5 memory module with up to 8533 MT/s and up to 16 GB system memory capacity | commercial grade temperature range from 0°C to 60°C.

                  Ecosystem Details

                  Virtualization

                  Hypervisor (P/N 300501)

                  Operating Systems

                  ctrlX OS (P/N 300020 )
                  Ubuntu Pro (P/N N/A)

                  IOT Software

                  Application Manager (P/N 300201)
                  COM Manager (P/N 300200)
                  Fleet Manager (P/N 300202)
                  Cloud Connector (P/N 300203)

                  Cooling Solutions

                  conga-TC1000r/HSP-B (P/N 052150)

                  Standard heatspreader for high performance COM Express module conga-TC1000r. All standoffs are with 2.7mm bore hole.

                  conga-TC1000r/HSP-T (P/N 052151)

                  Standard heatspreader for high performance COM Express module conga-TC1000r. All standoffs are M2.5mm threaded.

                  Carrierboards

                  conga TEVAL/ COMe 3.1 (P/N 065820)

                  Evaluation carrier board for COM Express Type 6 revision 3.1 modules.

                  Module services

                  Design-In Training (P/N 27000001)

                  Design-Training to develop carrier boards for Computer on Modules

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