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conga-TCV2

COM Express Type 6 Compact module based on AMD Embedded Ryzen V2000 embedded processor series

  • COM Express Compact Type 6
  • Next gen 7nm SOC
  • High performance Zen 2 CPU & VEGA 7 GPU
  • Huge scalability with TDP Range from 10-54W
  • Up to 64GByte dual channel DDR4 3200MT/s memory ECC & Non ECC
  • AMD Secure Processor with Secure Boot (SME)

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    Specification

    Formfactor
    COM Express Compact
    CPU
    AMD Ryzen Embedded V2516 (6 x 2.1 GHz, 3MB L2 cache, 10W)
    AMD Ryzen Embedded V2546 (6 x 3 GHz, 3MB L2 cache, 35W)
    AMD Ryzen Embedded V2718 (8 x 1.7 GHz, 4MB L2 cache, 10W)
    AMD Ryzen Embedded V2748 (8 x 2.9 GHz, 4MB L2 cache, 35W)
    DRAM
    Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s
    Ethernet
    1x 2,5GbE TSN Ethernet via Intel® i225
    I/O Interfaces
    8 x PCIe Gen3
    PEG support x8
    2 x USB 3.1 Gen2
    8 x USB 2.0
    2 x SATA III (6Gb/s)
    SPI
    2 x UART
    8 x GPIOs
    Graphics
    Integrated VEGA 7 graphics engine with up to 7 Compute Units | Supporting 4 independent display units (4x 4K) | DirectX 12 support | VCN2.2 (H.264/AVC HW 8b | H.265/HEVC HW 8/10b | VP9 HW 8/10b) | DP 1.4
    embedded BIOS Features
    OEM Customization
    Flash Update
    AMI Aptio UEFI
    Security
    Trusted Platform Module (TPM 2.0)
    Power Management
    ACPI 5.0 with battery support
    Operating Systems
    Microsoft® Windows® 10
    Microsoft® Windows 10 IoT Enterprise
    Linux
    Ubuntu
    RTS Hypervisor
    Temperature
    Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C
    Humidity
    Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
    Video Interfaces
    3x DP/DP++ | 1x eDP /LVDS
    Size
    95 x 95 mm (3,74" x 3,74")

    Documents

    All documents found on this page are updated without notification. Always check this page for the latest version.

    Data Sheet

    21.10.2021

    Accessories

    More about conga-TEVAL/COMe 3.0

    conga-TEVAL/COMe 3.0

    Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0

    More about conga-IT6

    conga-IT6

    COM Express Type 6 Carrier Board on Mini-ITX form factor

    Part Number

    050500
    conga-TCV2/V2748

    COM Express Type 6 Compact module based on AMD Embedded Ryzen V2748 8 core processor with 2.9GHz up to 4.25GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

    050501
    conga-TCV2/V2546

    COM Express Type 6 Compact module based on AMD Embedded Ryzen V2546 6 core processor with 3.0GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

    050502
    conga-TCV2/V2718

    COM Express Type 6 Compact module based on AMD Embedded Ryzen V2718 8 core processor with 1.7GHz up to 4.15GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

    050503
    conga-TCV2/V2516

    COM Express Type 6 Compact module based on AMD Embedded Ryzen V2516 6 core processor with 2.1GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

    050550
    conga-TCV2/CSA-HP-B

    Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with
    2.7mm bore hole.

    050551
    conga-TCV2/CSA-HP-T

    Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

    050552
    conga-TCV2/CSP-HP-B

    Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.

    050553
    conga-TCV2/CSP-HP-T

    Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.

    050554
    conga-TCV2/HSP-HP-B

    Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.

    050555
    conga-TCV2/HSP-HP-T

    Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.

    conga-TCV2/V2516
    P/N 050503

    COM Express Type 6 Compact module based on AMD Embedded Ryzen V2516 6 core processor with 2.1GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

    conga-TCV2/V2546
    P/N 050501

    COM Express Type 6 Compact module based on AMD Embedded Ryzen V2546 6 core processor with 3.0GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

    conga-TCV2/V2718
    P/N 050502

    COM Express Type 6 Compact module based on AMD Embedded Ryzen V2718 8 core processor with 1.7GHz up to 4.15GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

    conga-TCV2/V2748
    P/N 050500

    COM Express Type 6 Compact module based on AMD Embedded Ryzen V2748 8 core processor with 2.9GHz up to 4.25GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

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