Press Releases

congatec and Aaronn Electronic join forces to deliver greater product diversity, faster development times, and personalized support in the DACH region

New VDC Research white paper with congatec and NXP: Standardized COMs with i.MX 95 processors drive industrial vision AI adoption amidst 48.3% edge AI growth

congatec to showcase application-ready embedded solution platforms at CIIF 2025 in Shanghai

congatec GmbH holds majority of JUMPtec GmbH, strengthens technology leadership and Computer-on-Module portfolio

New local manufacturing capacities strengthen congatec's global presence and address international trade disruptions

High-performance ecosystems for innovative solutions

Atlanta, USA / Deggendorf, Germany, March 11, 2025 * * * AMI®, the global leader in Dynamic Firmware for worldwide computing, and congatec, a leading provider of embedded and edge computing…

COMs just got even cooler

Unrivaled AI performance for COMs with Intel Core Ultra processors

Empowering smart factories: congatec highlights application-ready solution platforms

Application-ready software building blocks for simple and fast IoT connectivity

More AI and graphics performance for low-power SMARC modules

New performance boost for COMs with Intel Core S technology