Simplifying the use of embedded technology – congatec @ embedded world 2027
March 16th - 18th | Booth 3C-316
Let’s meet at embedded world 2027, the global platform and place to be for the entire embedded community, in Nuremberg, Germany from March 16th to March 18th.
Visit congatec in Hall 3C, Booth 316 and experience our application-ready embedded computing portfolio - combining aReady. Computer-on-Modules, software, and services into one coherent ecosystem.
Our hardware buildings block based on COM-HPC, COM Express, and SMARC, along with software and service building blocks, are an integral part of our aReady. strategy, enabling smarter, more energy-efficient, future-ready, and secure embedded systems.
This is what you can expect at our booth (or at least what we can already tell you about – more announcements coming soon):
Here is what we can tell you so far…
New Intel® Core™ Ultra Series 3 modules
Our ecosystem features the industry's broadest portfolio of Computer-on-Modules based on Intel® Core™ Ultra Series 3 (Panther Lake), delivering up to 180 TOPS of integrated AI acceleration with strong power efficiency for embedded applications.
High-performance Arm ecosystem
Our Arm ecosystem is extended with our first COM-HPC Mini featuring Qualcomm Dragonwing IQ-X, offering exceptional AI performance and power efficiency for edge applications.
Efficient entry into rugged embedded edge AI
Get to know our COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series.
Application-ready hardware and software building blocks simplifying AI, IoT, and security integration for faster time-to-market.
From modular building blocks to fully-certified systems – designed with trusted partners.
Explore now
