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conga-sdIL

COM-HPC Server Size D module based on Intel® Xeon® D-1700 / D-1800 (code name "Ice Lake")

Ausgewählte Modulvariante

    Ausgewählte Ecosystem Parts

    Carrierboards

      Cooling Solutions

        Zusätzliche Ecosystem Parts


        Carrierboards

        Cooling Solutions

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        conga-sdIL

        formerly JUMPtec COMh-sdIL
        COM-HPC Server Size D module based on Intel® Xeon® D-1700 / D-1800 (code name "Ice Lake")

        Learn all about COMs - download the guide

        • Industrial Use Condition with extended Temperature options
        • Intel® Xeon® D-1700 / D-1800 SOC processors
        • 8x LAN Ports: versatile configurations up to 100G
        • Up to 1 TByte NVMe SSD onboard
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        Wollen Sie noch weitere Produkte aus unserem Ecosystem (zB. Carrierboards oder Arbeitsspeicher) zu Ihrer Anfrage hinzufügen?

        Zusätzliche Ecosystem Parts

        Carrierboards

        Cooling Solutions

        Spezifikation

        Formfactor
        COM-HPC
        CPU
        Intel® Xeon® D-1715TER (4 x 2.4 GHz, 10 MB cache, 50G Eth, 50W)
        Intel® Xeon® D-1732TE (8 x 1.9 GHz, 15 MB cache, 50G Eth, 52W)
        Intel® Xeon® D-1746TER (10 x 2.0 GHz, 15 MB cache, 100G Eth, 67W)
        DRAM
        Up to 64GB DDR4-2667 soldered memory - ECC, extended temp
        Ethernet
        1 x 1/2.5 Gb Ethernet
        100GbE/2x 50GbE/4x 25GbE/2x 25GbE + 4x 10GbE/8x 10GbE
        I/O Interfaces
        16 x PCIe Gen4
        16 x PCIe Gen3
        4 x USB 3.0
        4 x USB 2.0
        2 x SATA 6 Gb/s
        SPI
        eSPI
        SM-Bus
        SATA Gen 3.2
        Mass storage
        Up to 1 TByte NVMe SSD (on request)
        embedded BIOS Features
        AMI Aptio UEFI
        Security
        Trusted Platform Module (TPM 2.0)
        Power Management
        ACPI 6.0
        Operating Systems
        Linux
        Microsoft® Windows 11
        Microsoft® Windows® 10
        Windows Server 2022
        Temperature
        Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
        Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
        Humidity
        93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
        Features
        Staged Watchdog
        Size
        120 x 160 mm

        Dokumente

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        Data Sheet

        Data sheet for conga-sdIL
        15.12.2025

        Whitepaper

        The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

        Produktvarianten

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            conga-sdIL/D-1746TER (P/N HSD04-6400-46-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-1746TER processor, 64 GB ECC memory, SoC-LAN support for 4× 25G-KR and operating temperature from −40 °C to +85 °C.

            conga-sdIL/D-1732TE (P/N HSD04-3200-32-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-1732TE processor, 32 GB ECC memory, SoC-LAN support for 5× 10G-KR and operating temperature from −40 °C to +85 °C.

            conga-sdIL/D-1715TER (P/N HSD04-1600-15-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-1715TER processor, 16 GB ECC memory, SoC-LAN support for 5× 10G-KR and operating temperature from −40 °C to +85 °C.

            Ecosystem Details

            Carrierboards

            COM-HPC/SERVER EVAL-CARRIER (P/N HST01-0001-10-0)

            Evaluation Carrier with 10-mm stack-up connector

            Cooling Solutions

            COMh-sdIL (E2) HSP THREADED (P/N HSD04-0000-99-0)

            COMh-sdIL (E2) heatspreader threaded

            COMh-sdIL (E2) HSP THROUGH HOLE (P/N HSD04-0000-99-1)

            COMh-sdIL (E2) heatspreader through hole

            COMh SIZE D ACTIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-0)

            COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

            COMh SIZE D PASSIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-1)

            COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

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