COM Express Typ 7 Ecosystem

Most powerful COM Express modules for embedded edge and fog servers

Our COM Express Type 7 Server-on-Module ecosystem targets enhanced micro servers and other server-like applications that permit only low power consumption but require high computing performance and communication throughput. We also provide passive cooling solutions for designs with up to 100 W heat dissipation to simplify the design-in of these ultra-powerful COM Express modules. For embedded server applications requiring more than 4x10 GbE and 32x PCIe lanes, designers should also check out our COM-HPC Server ecosystem.

Details zur COM Express Spezifikation

 

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    Virtualization Ready
    • Intel® Xeon® D1700 processors
    • Up to 10 cores
    • Up to 128 GB RAM
    • Extended temperature options
    • Up to 4x 10 GbE supporting CEI/KR/SFI
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    • AMD EPYC™ Embedded 3000 Series
    • Up to 16 cores
    • Up to 96 GB RAM
    • Extended temperature options
    • 4x 10 GbE with KR interface support
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    • Intel Atom® C3000 processor family
    • Up to 16 cores
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    • Power-optimized design
    • 4x 10 GbE with KR interface support
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    • Intel® Xeon® D1500 and Intel® Pentium® processors
    • Up to 16 cores
    • Up to 96 GB RAM
    • Optional ECC support
    • 2x 10 GbE with KR interface support
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    • Evaluation carrier board for COM Express Type 7
    • 4x PCIe slots for 32 lanes
    • 4x 10 Gigabit Ethernet SFP+
    • BMC with VGA, iKVM, virtual storage
    • Extended temperature options