congatec's high-performance ecosystem

Facts	Features	Benefits
Comprehensive Computer-on-Module portfolio	x86 and Arm-based Computer-on-Modules, tailored cooling solutions, accompanying services for design qualification, and individual BIOS and bootloader adaptations	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.
Vendor-independent standards	Support of the high-performance PICMG standards COM-HPC and COM Express as well as the low-power SGeT standard SMARC	Broad support from a huge community and multiple vendors increases design security and long-term availability through second-source strategies. Also increases supply chain resilience.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.
Application-ready super-components	Computer modules come as fully developed super-components implementing CPU, RAM and computer I/Os and featuring software support packages	Computer-on-Modules offer robot designers the best of both worlds: The high design security of ready-made modules and the high customizability of carrier boards. The modular approach enables high scalability and easy upgradability with a simple module change.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.
Most comprehensive COM-HPC offering	congatec offers the most comprehensive COM-HPC ecosystem	Designers get everything they need in the form they need from one reliable vendor. Suitable and highly scalable modules, tailored and most efficient cooling solutions, corresponding evaluation and application carriers, board support packages, as well as design-in services from definition phase to validation phase.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.	Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers.

 

 

Facts, Features & Benefits

Facts	Features	Benefits
Heterogeneous High-Performance Architecture	Up to 16 AMD “Zen 5” CPU cores, AMD Radeon™ RDNA™ 3.5 GPU, and AMD XDNA™ 2 NPU, integrated into a single SoC.	Consolidates real-time control, AI inference, and highly parallel data processing on a single platform while eliminating the need for discrete graphics cards or AI accelerators.
Powerful Zen 5 CPU Cores	Up to 16 CPU cores with clock speeds of up to 5.1 GHz	Delivers outstanding single- and multi-core performance for real-time control, sensor fusion, decision-making, and communication workloads.
Integrated RDNA™ 3.5 GPU (iGPU)	Up to 59 TOPS of AI inference (INT8) and up to 29.7 TFLOPS FP32 compute performance	High-performance general-purpose GPU (GPGPU) for highly parallel workloads and the local execution of LLMs, combined with immersive graphics across up to four independent displays for demanding gaming, AV, and industrial multi-display applications.
XDNA™ 2 NPU	Up to 50 TOPS AI processing performance	Enables AI inference with low power consumption and accelerates physical AI applications such as robotics, machine vision, autonomous vehicles, and intelligent medical devices with outstanding energy efficiency.
Unified Memory Architecture	Up to 128 GB LPDDR5x-8533 memory with shared access for CPU, GPU, and NPU and up to 96 GB allocatable to the integrated GPU	Enables highly efficient data sharing between CPU, GPU, and NPU, minimizes data transfer latency, and significantly improves the performance of memory-intensive AI and GPGPU workloads. The large GPU memory allocation also enables local execution of large LLMs and multimodal AI models without requiring discrete AI accelerators.
Industrial-grade Robustness	Industrial temperature range from -40°C to +85°C, soldered memory, and long-term availability	Designed for reliable operation in harsh industrial, transportation, and outdoor environments while improving thermal resilience and increasing mean time between failures (MTBF), reducing maintenance requirements and total cost of ownership (TCO). Long-term availability further extends overall system lifetime.
Programmable Power Configuration	Scalable TDP range from 45 to 120 W with a base TDP of 55 W	Supports different performance levels while simplifying thermal design across multiple products sharing a common hardware basis.
Extensive I/O	Up to 24 PCIe Gen4 lanes	The many PCIe lanes are ideal for I/O-intensive applications requiring numerous peripheral devices. Industrial Ethernet interfaces, fieldbus adapters, wireless communication modules, and other low-lane devices can be integrated with ease. Additional interfaces include 2x 2.5GbE, up to 4x USB 3.2 Gen2, up to 8x USB 2.0, up to 2x SATA 6 Gb/s, 2x I²C, 2x UART, 12x GPIO, 1x SMBus, and 1x GPSPI.