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conga-TC750

COM Express Type 6 Compact module based on Intel® Core™ Ultra processors (code name "Arrow Lake")

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                  conga-TC750

                  COM Express Type 6 Compact module based on Intel® Core™ Ultra processors (code name "Arrow Lake")

                  aReady
                  • Cutting edge Intel® Arc™ Graphics with XMX Systolic Arrays and up to 128 EUs
                  • Next level Edge AI performance up to 99 TOPS total
                  • Up to 128 GB RAM with in-band ECC
                  • Intel® performance hybrid architecture with up to 16 cores and 22 threads
                  • PCI Express Gen 4 | USB 4
                  • Virtualization ready with Hypervisor
                  Congatec Logo
                  Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

                  Value adding ecosystem offerings

                  Virtualization

                  Operating Systems

                  IOT Software

                  Cooling Solutions

                  Memory

                  Carrierboards

                  Module services

                  Specification

                  Formfactor
                  COM Express Compact
                  CPU
                  Intel® Core™ Ultra 9-285H (6 P-cores 2.9Ghz up to 5.4GHz, 8 E-Cores 2.7GHz up to 4.5GHz, 2 Low Power E-cores 1GHz up to 2.5GHz, 24MB Intel® Smart Cache)
                  Intel® Core™ Ultra 7-255H (6 P-cores 2.0Ghz up to 5.1GHz, 8 E-Cores 1.5GHz up to 4.4GHz, 2 Low Power E-cores 700MHz up to 2.5GHz, 24MB Intel® Smart Cache)
                  Intel® Core™ Ultra 5-225H (4 P-cores 1.7Ghz up to 4.9GHz, 8 E-Cores 1.3GHz up to 4.3GHz, 2 Low Power E-cores 700MHz up to 2.5GHz, 18MB Intel® Smart Cache)
                  Intel® Core™ Ultra 7-255U (2 P-cores 2.0Ghz up to 5.2GHz, 8 E-Cores 1.7GHz up to 4.2GHz, 2 Low Power E-cores 700MHz up to 2.4GHz, 12MB Intel® Smart Cache)
                  Intel® Core™ Ultra 5-225U (2 P-cores 1.5Ghz up to 4.8GHz, 8 E-Cores 1.3GHz up to 3.8GHz, 2 Low Power E-cores 700MHz up to 2.4GHz, 12MB Intel® Smart Cache)
                  DRAM
                  2x SO-DIMM sockets for DDR5 memory modules up to 64 GB each (max. 128 GB RAM system capacity) |up to 6400 MT/s | in-band ECC
                  Ethernet
                  2.5 GbE with TSN support via Intel® i226 Ethernet controller series
                  Supporting TSN - Time Sensitive Networking (selected PNs)
                  Software Definable Pin (SDP) to be used for IEEE 1588
                  I/O Interfaces
                  Up to 8 PCIe Gen5 PEG (H-Series) or up to 2x4 PCIe Gen4 PEG (U-Series)
                  up to 8 PCIe Gen4
                  up to 2x USB4
                  4x USB 3.2 Gen2 (incl. USB 2.0) + 8x USB 2.0
                  up to 2x SATA
                  2 x UART
                  GPIOs
                  SPI
                  LPC
                  SM-Bus
                  I²C
                  Mass storage
                  NVMe x4 SSD (optional) up to 1 TB capacity
                  Graphics
                  Intel® Arc™ Graphics architecture | up to 8 Xᵉ Cores with 128 EUs
                  NPU/AI Acceleration
                  Integrated NPU accelerator on all part numbers
                  Up to 99 TOPS (platform total)
                  congatec Board Controller
                  Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code
                  embedded BIOS Features
                  AMI Aptio® UEFI firmware
                  64Mbyte serial SPI with congatec Embedded BIOS feature
                  OEM Logo
                  OEM CMOS Defaults
                  LCD Control
                  Display Auto Detection
                  Backlight Control
                  Flash Update
                  Security
                  Trusted Platform Module (TPM 2.0)
                  Power Management
                  ACPI 6.0 with battery support
                  Operating Systems
                  Microsoft® Windows 11 IoT Enterprise
                  Microsoft® Windows 11
                  Microsoft® Windows 10 IoT Enterprise
                  Linux
                  Yocto
                  Hypervisor
                  RTS Real-Time Hypervisor
                  Temperature
                  Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
                  Humidity
                  Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
                  Video Interfaces
                  Up to 3x DDI (2x shared with USB4)
                  LVDS or eDP
                  4 x independent displays up to 8k
                  Size
                  95 x 95 mm (3,74" x 3,74")

                  Documents

                  All documents found on this page are updated without notification. Always check this page for the latest version.

                  Data Sheet

                  Data sheet for conga-TC750
                  13.02.2025

                  Product Variants

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                    There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
                    If you don't find the configuration you require contact your congatec Sales representative for further assistance.
                    conga-TC750/ultra5-225U (P/N 045724)

                    COM Express Type 6 Compact module based on Intel® Coreâ„¢ Ultra 5 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.5Ghz up to 4.8GHz (turbo) | E-Cores 1.3GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.4GHz (turbo) |Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) |Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 15W Base-TDP | Intel® code name Arrow Lake-U

                    conga-TC750/ultra7-255U (P/N 045723)

                    COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 2.0Ghz up to 5.2GHz (turbo) | E-Cores 1.7GHz up to 4.2GHz (turbo) | Low Power E-cores up to 2.4GHz (turbo) |Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) |Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 15W Base-TDP | Intel® code name Arrow Lake-U

                    conga-TC750/ultra5-225H (P/N 045722)

                    COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 4 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.7Ghz up to 4.9GHz (turbo) | E-Cores 1.3GHz up to 4.3GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) |Integrated NPU | 18MB Intel® Smart Cache | Intel® Arc™ 130T graphics with 7 Xe cores (112 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s | 28W Base-TDP | Intel® code name Arrow Lake-H

                    conga-TC750/ultra7-255H (P/N 045721)

                    COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 2.0Ghz up to 5.1GHz (turbo) | E-Cores 1.5GHz up to 4.4GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) |Integrated NPU | 24MB Intel® Smart Cache | Intel® Arc™ 140T graphics with 8 Xe cores (128 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s |28W Base-TDP | Intel® code name Arrow Lake-H

                    conga-TC750/ultra9-285H (P/N 045720)

                    COM Express Type 6 Compact module based on Intel® Core™ Ultra 9 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 2.9Ghz up to 5.4GHz (turbo) | E-Cores 2.7GHz up to 4.5GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) |Integrated NPU | 24MB Intel® Smart Cache | Intel® Arc™ 140T graphics with 8 Xe cores (128 EU) | Dual channel SODIMM DDR5 memory interface up to 5600 MT/s |45W Base-TDP | Intel® code name Arrow Lake-H

                    Ecosystem Details

                    Virtualization

                    Hypervisor (P/N 300501)

                    Operating Systems

                    ctrlX OS (P/N )
                    Ubuntu Pro (P/N N/A)

                    IOT Software

                    COM Manager (P/N 300200)
                    Application Manager (P/N 300201)
                    Fleet Manager (P/N 300202)
                    Cloud Connector (P/N 300203)

                    Cooling Solutions

                    conga-TC700/CSA-HP-B (P/N 045750)

                    Standard active cooling solution for high performance COM Express modules conga-TC700/TC750 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

                    conga-TC700/CSA-HP-T (P/N 045751)

                    Standard active cooling solution for high performance COM Express modules conga-TC700/TC750 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.

                    conga-TC700/CSP-HP-B (P/N 045752)

                    Standard passive cooling solution for high performance COM Express modules conga-TC700/TC750 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole.

                    conga-TC700/CSP-HP-T (P/N 045753)

                    Standard passive cooling solution for high performance COM Express modules conga-TC700/TC750 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded.

                    conga-TC700/HSP-HP-B (P/N 045754)

                    Standard heatspreader for high performance COM Express modules conga-TC700/TC750 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole.

                    conga-TC700/HSP-HP-T (P/N 045755)

                    Standard heatspreader for high performance COM Express modules conga-TC700/TC750 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded.

                    Memory

                    DDR5-SODIMM-5600 (8GB) (P/N 068930)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C

                    DDR5-SODIMM-5600 (16GB) (P/N 068931)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C

                    DDR5-SODIMM-5600 (32GB) (P/N 068932)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C

                    DDR5-SODIMM-5600 (48GB) (P/N 068933)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C

                    Carrierboards

                    conga-TEVAL2 (P/N 065810)

                    Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.

                    conga-TEVAL3/COMe3.1 (P/N 065820)

                    congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°C

                    Module services

                    Design-In Training (P/N 27000001)

                    Design-Training to develop carrier boards for Computer on Modules

                    Conformal Coating COM Express Basic and Compact (P/N )

                    HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
                    RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.