COM-HPC Mini Ecosystem
High-performance standard in a nearly credit-card sized form factor
Our COM-HPC Mini ecosystem offers extraordinary performance and I/O density for space- and power-restricted applications. Target use cases can be found in all next-generation high-end embedded systems, including embedded vision for which it also offers two MIPI-CSI interfaces.
- Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
- Up to 16 CPU cores
- Integrated NPU with up to 50 TOPS
- Up to 96 GB LPDDR5x
- Industrial temperature range
- Qualcomm® Dragonwing IQ-X processors
- Up to 12 Oryon™ CPU cores
- Hexagon™ NPU with 45 TOPS
- Up to 64 GB LPDDR5x
- Industrial Temp. Range
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/3.5-Mini
- Compact Application Carrier for COM-HPC Mini Modules
- Scalable 3.5” motherboard
- Longevity by module concept
- Quick start for COM-HPC Mini designs
conga-HPC/EVAL-Mini
- Evaluation Carrier for COM-HPC Mini Modules
- Routing of the entire signals provided by COM HPC Module Base Specification to standard interface connectors
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