Press Releases

congatec launches aReady.YOURS Partner Program for market-specific system solutions

Scalable Edge Performance for Demanding Applications

congatec extends aReady.COM to Arm based modules – application-ready hardware and software building blocks, complete with OS, system consolidation, and IoT connectivity for value-generating applications based on NXP i.MX 95 applications processor

More consistent power for COM-HPC client platforms

congatec centralizes customization design and software integration services in new Customer Application Center and launches aReady.YOURS

Seasoned Finance Executive Strengthens International Market Position

congatec expands its highly skilled engineering team, establishing congatec Asia Embedded Design Sdn. Bhd. in Penang, Malaysia

congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series

Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications

KontronOS, the secure, hardened Linux®-based Operating System, expands congatec’s standards-based and cybersecure aReady.COM offering

New COM-HPC Mini module from congatec with Qualcomm Dragonwing™ IQ-X processors opens up new applications

congatec embedded Computer-on-Modules accelerate rugged high-performance edge AI with Qualcomm Dragonwing™ processors

congatec presents its expanded portfolio and aReady.COM platforms

Company drives attendance with free exhibit hall pass, $50 value

conga-TC675r completes IEC 60068 testing, offering a compact, application-ready embedded module for extreme environments

congatec and Aaronn Electronic join forces to deliver greater product diversity, faster development times, and personalized support in the DACH region

New VDC Research white paper with congatec and NXP: Standardized COMs with i.MX 95 processors drive industrial vision AI adoption amidst 48.3% edge AI growth

congatec to showcase application-ready embedded solution platforms at CIIF 2025 in Shanghai

congatec GmbH holds majority of JUMPtec GmbH, strengthens technology leadership and Computer-on-Module portfolio

New local manufacturing capacities strengthen congatec's global presence and address international trade disruptions

High-performance ecosystems for innovative solutions

Atlanta, USA /  San Diego, CA, March 11, 2025 * * * AMI®, the global leader in Dynamic Firmware for worldwide computing, and congatec, a leading provider of embedded and edge computing technology,…

COMs just got even cooler

Unrivaled AI performance for COMs with Intel Core Ultra processors

Empowering smart factories: congatec highlights application-ready solution platforms

Application-ready software building blocks for simple and fast IoT connectivity

More AI and graphics performance for low-power SMARC modules

New performance boost for COMs with Intel Core S technology

From start-up to world leader in embedded computing technology

Offering the best Ubuntu Pro experience on congatec aReady.COMs

A new level of application readiness - for increased efficiency and reliability

Compact module delivers 39 TOPS AI performance

congatec modules set new benchmarks for secure edge AI applications

Newly integrated IIoT capabilities create added value

Focus on security (NIS-2) and sustainability with offline AI and modular design

The faster, more sustainable route to dedicated high-end 3.5-inch systems

Eight cores unlock advanced virtualization potential

COM-HPC Mini specification is now complete

congatec expands its modular edge server ecosystem with a µATX server carrier board and new COM HPC Server-on-Modules based on the latest Intel Xeon processors