COM Express Type 6 Compact module with Intel® Celeron® Processor 3765U dual core processor with 1.9GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface
conga-TC97
COM Express Type 6 Compact module based on 5th Generation Intel® Core™ processor family
- 第5世代 Intel® Core™ i7 デュアルコアプロセッサ
- 15W 公称 TDP
- 3x DisplayPort 1.2、最大解像度 4000
- Intel® AVX 2.0 Vector 拡張子で浮動小数点を改善
Specification
Operating: 0 to +60°CStorage: -20 to +80°C
Documents
Data Sheet
Software
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Product Variants
COM Express Type 6 Compact module with Intel® Core™ i3-5010U dual core processor with 2.1GHz, 3MB L2 cache and 1600MT/s dual channel DDR3L memory interface.
COM Express Type 6 Compact module with Intel® Core™ i5-5350U dual core processor with 1.8GHz, 3MB L2 cache and 1600MT/s dual channel DDR3L memory interface.
COM Express Type 6 Compact module with Intel® Core™ i7-5650U dual core processor with 2.2GHz, 4MB L2 cache and 1600MT/s dual channel DDR3L memory interface.
Ecosystem Details
Cooling solutions
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
Memory
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Accessories
conga-LDVI
LVDSからDVIへ変更モジュール
conga-TEVAL/COMe 2.1
COM Express® Type 6モジュール評価用キャリアボード