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conga-TC97 (EOL)

COM Express Type 6 Compact module based on 5th Generation Intel® Core™ processor family

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          Cooling Solutions

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          conga-TC97 (EOL)

          COM Express Type 6 Compact module based on 5th Generation Intel® Core™ processor family

          • Processore dual core Intel® Core™ i7 di 5° gen.
          • TDP nominale di 15 W
          • 3x DisplayPort 1.2, fino a 4k di risoluzione
          • Estensione Intel® AVX 2.0 Vector per miglioramento virgola mobile

          Specification

          Formfactor
          COM Express Compact
          CPU
          Intel® Core™ i7-5650U (2 x 2.2 GHz, 4MB cache, 15W)
          Intel® Core™ i5-5350U (2 x 1.8 GHz, 3MB cache, 15W)
          Intel® Core™ i3-5010U (2 x 2.1 GHz, 3MB cache, 15W)
          Intel® Celeron® 3765U (2 x 1.9 GHz, 2MB cache, 15W)
          DRAM
          max. 32 GByte DDR3L 1600 MHz
          Ethernet
          Intel® I218-LM GbE LAN Controller with AMT 10 support
          I/O Interfaces
          4 x PCIe 2.0
          4 x SATA
          2 x Express Card®
          2 x USB 3.0
          8 x USB 2.0
          LPC bus
          I²C bus
          Graphics
          Intel® HD Graphics with OpenCL 2.0, OpenGL 4.3 and DirectX11.2 support | up to three independent displays: DVI, DisplayPort 1.2
          congatec Board Controller
          Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
          embedded BIOS Features
          AMI Aptio® 2.X (UEFI) firmware
          8/16 MByte serial SPI firmware flash
          Security
          The conga-TC97 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0).
          Power Management
          ACPI 4.0
          Operating Systems
          Microsoft® Windows® 7
          Linux
          Microsoft® Windows® embedded Standard
          Temperature
          Standard
          Operating: 0 to +60°C Storage: -20 to +80°C
          Humidity
          Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
          Video Interfaces
          LVDS 2x24
          2 x DDI / DisplayPort 1.2a with support for Multi-Stream Transport (MST), resolutions up to 4k
          Size
          95 x 95 mm (3,74" x 3,74")

          Documents

          All documents found on this page are updated without notification. Always check this page for the latest version.

          Data Sheet

          25.03.2021

          Product Variants

          conga-TC97/i7-5650U (P/N 045103)

          COM Express Type 6 Compact module with Intel® Core™ i7-5650U dual core processor with 2.2GHz, 4MB L2 cache and 1600MT/s dual channel DDR3L memory interface.

          conga-TC97/i5-5350U (P/N 045104)

          COM Express Type 6 Compact module with Intel® Core™ i5-5350U dual core processor with 1.8GHz, 3MB L2 cache and 1600MT/s dual channel DDR3L memory interface.

          conga-TC97/i3-5010U (P/N 045105)

          COM Express Type 6 Compact module with Intel® Core™ i3-5010U dual core processor with 2.1GHz, 3MB L2 cache and 1600MT/s dual channel DDR3L memory interface.

          conga-TC97/3765U (P/N 045106)

          COM Express Type 6 Compact module with Intel® Celeron® Processor 3765U dual core processor with 1.9GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface

          Ecosystem Details

          Cooling Solutions

          conga-TC170/HSP-B (P/N 045230)

          Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.

          conga-TC170/HSP-T (P/N 045231)

          Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded

          conga-TC170/CSP-B (P/N 045232)

          Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.

          conga-TC170/CSP-T (P/N 045233)

          Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded

          conga-TC170/CSA-B (P/N 045234 )

          Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan. 

          conga-TC170/CSA-T (P/N 045235)

          Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan. 

          Memory

          DDR3L-SODIMM-1600 (2GB) (P/N 068755)

          DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.

          DDR3L-SODIMM-1600 (4GB) (P/N 068756)

          DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.

          DDR3L-SODIMM-1600 (8GB) (P/N 068757)

          DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.

          Carrierboards

          conga-TEVAL (P/N 065800)

          Evaluation Carrier Board for COM Express Type 6 Modules.

          Accessories

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          conga-LDVI

          Covertitore di moduli DVI perLVDS

          More about conga-TEVAL/COMe 2.1 (EOL)

          conga-TEVAL/COMe 2.1 (EOL)

          Scheda Carrier di valutazione per i Moduli COM Express® Type 6

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