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conga-TS67 (EOL)
Modulo COM Express™ Basic di tipo 6 (versioni BGA a bassa potenza)
- Basato su processori Intel® Core™ a bassa potenza di seconda generazione in pacchetto BGA con fattore di forma ridotto (SFF)
- CPU saldate per superiore resistenza agli urti
- Soluzione ideale per applicazioni grafiche complesse
Specification
Two independent pipelines for full dual view support optional High performance hardware MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 MBit/s, hardware motion compensation
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Manual
Application Note
Document
Image
Data Sheet
Software
Product Variants
Ecosystem Details
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Cooling solutions
Standard heatspreader for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes. All standoffs are M2.5mm thread
Standard heatspreader for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes. All standoffs are with 2.7mm bore hole
Standard passive cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes
15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread
Standard passive cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes
15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole
Standard active cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes | 15mm silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread
Standard active cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes | 15mm silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
Accessories
conga-FPA2 (EOL)
Scheda per Adattatore Universale flat Panel
conga-LDVI
Covertitore di moduli DVI perLVDS
conga-TEVAL/COMe 2.1 (EOL)
Scheda Carrier di valutazione per i Moduli COM Express® Type 6