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  • COM-HPC & COM Express Server-on-Modules based on Intel® Xeon D processors  | Ice Lake

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conga-HPC/sILL

COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")

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Value adding ecosystem offerings


Cooling solutions

Carrierboards

Memory

Module services

conga-HPC/sILL

COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")

Virtualization Ready
  • Industrial Use Condition with extended Temperature options
  • 32 PCIe Express lanes
  • AI Capabilities with Intel® DL boost
  • Real Time Capable Platform
  • Supporting up to 256 GB DDR4 2933MT/s Memory
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Value adding ecosystem offerings

Cooling solutions

Carrierboards

Memory

Module services

Specification

Formfactor
COM-HPC
CPU
Intel® Xeon® D-1848TER (10 x 2.0 GHz, 15 MB cache, 100G Eth, 57W)
Intel® Xeon® D-1712TR (4 x 2.0 GHz, 10 MB cache, 50G Eth, 39W)
Intel® Xeon® D-1735TR (8 x 2.2 GHz, 15 MB cache, 50G Eth, 59W)
Intel® Xeon® D-1715TER (4 x 2.4 GHz, 10 MB cache, 50G Eth, 50W)
Intel® Xeon® D-1732TE (8 x 1.9 GHz, 15 MB cache, 50G Eth, 52W)
Intel® Xeon® D-1746TER (10 x 2.0 GHz, 15 MB cache, 100G Eth, 67W)
DRAM
4x DIMM sockets for DDR4 memory modules | Max. capacity = 256GB
Ethernet
1 x 2.5GbE TSN Ethernet
2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU)
I/O Interfaces
16 x PCIe Gen4
16 x PCIe Gen3
4 x USB 3.0
4 x USB 2.0
2 x SATA III (6Gb/s)
2 x UART
12 x GPIOs
2 x SM-Bus
2 x I²C bus
congatec Board Controller
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
embedded BIOS Features
AMI Aptio UEFI
64Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
Flash Update
Security
Trusted Platform Module (TPM 2.0)
Power Management
ACPI 5.0 with battery support
Operating Systems
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Microsoft® Windows IoT 10 Core
Linux
Android
Yocto
Hypervisor
RTS Real-Time Hypervisor
Temperature
Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +85°C
Industrial: Operating Temperature: -40 to +85°C | Storage Temperature: -40 to +85°C (depending on CPU)
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Size
160 x 160 mm

Documents

All documents found on this page are updated without notification. Always check this page for the latest version.

Data Sheet

Software

EFI

cgutil_v162.zip
04.07.2023 / 2.20 Mo
congatec System Utility Rev. 1.6.2
Use for BIOS update or customization and panel configuration.

Linux

CGOS direct driver for Linux.
cgutillx.tar
04.07.2023 / 3.93 Mo
congatec System Utility Rev. 1.6.2
Use for BIOS update or customization and panel configuration. Linux source version.
ice-1.13.7.tar.gz
18.01.2024 / 1.24 Mo
Linux driver ice 1.13.7.tar for the integrated SFP/QSFP network adapter E823
Linux_DRM_1.14.2_2.zip
18.01.2024 / 21.17 Mo
ASPEED BMC Graphics Driver for ASPEED 2600 for Linux.

Windows 10

CgMlfTools_2019_10_24.zip
25.03.2024 / 16.68 Mo
The congatec Menu Layout File Viewer (CgMlfViewer) and the congatec Menu Layout File Editor (CgMlfEditor) are Qt based applications meant to read Menu Layout Files (*.mlf) created by a congatec BIOS, to display all setup nodes and options and for the CgMlfEditor also to edit them.
CGOS direct driver for Windows 10 and Windows 11. Please refer to readme.txt for supported functions and boards.

Windows Server 2019

Intel chipset driver version 10.1.19485.8386 for Icelake-D LCC.
v11501_windows.zip
18.01.2024 / 2.58 Mo
ASPEED BMC Graphics Driver v.11501 for ASPEED 2600 for Windows Server 2019.
Intel Vitual Raid on CPU (VROC) Driver for Windows Server
Wired_driver_28.3_x64.zip
18.01.2024 / 25.39 Mo
Intel(R) Network Connections Software Version 28.3 for Intel i225/i226/E823-L for Windows 10 and Windows Server 2019

yocto

README_Yocto-4-1-1-bsp.txt
21.03.2023 / 18.32 Ko
Documentation for the congatec Yocto 4.1.1 BSP for x86 platforms. For sample images please contact congatec support.

Product Variants

Product Filter:

    Add Filter:

    There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
    If you don't find the configuration you require contact your congatec Sales representative for further assistance.
    conga-HPC/sILL-D1712TR (P/N 050411)

    COM-HPC Size D module based on Intel® Xeon® D1712TR 4-core processor with 2.0 GHz, 10MB cache and dual channel DDR4 up to 2400 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0°C to 60°C.

    conga-HPC/sILL-D1715TER (P/N 050402)

    COM-HPC Size D module based on Intel® Xeon® D1715TER 4-core processor with 2.4 GHz, 10MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Extended temperature range from -40°C to 80°C.

    conga-HPC/sILL-D1732TE (P/N 050401)

    COM-HPC Size D module based on Intel® Xeon® D1732TE 8-core processor with 1.9 GHz, 15MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40°C to 85°C.

    conga-HPC/sILL-D1735TR (P/N 050410)

    COM-HPC Size D module based on Intel® Xeon® D1735TR 8-core processor with 2.2 GHz, 15MB cache and dual channel DDR4 up to 2933 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0°C to 60°C.

    conga-HPC/sILL-D1746TER (P/N 050400)

    COM-HPC Size D module based on Intel® Xeon® D1746TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40°C to 85°C.

    conga-HPC/sILL-D1848TER (P/N 050412)

    COM-HPC Size D module based on Intel® Xeon® D-1848TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D Refresh LCC). Industrial temperature range from -40°C to 85°C.

    Ecosystem Details

    Cooling solutions

    conga-HPC/sILL-CSA-HP (P/N 050450)

    Standard active cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 35.2mm overall cooling height and integrated 12V fan.

    conga-HPC/sILL-CSP-HP (P/N 050451)

    Standard passive cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 18.2mm overall cooling height. 

    conga-HPC/sILL-HSP-HP-B (P/N 050452)

    Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.

    conga-HPC/sILL-HSP-HP-T (P/N 050453)

    Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.

    conga-HPC/sILL-HPA (P/N 050454)

    Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILL. Suitable for standard 8 mm heat pipes to optimize heat distribution.

    Carrierboards

    conga-HPC/EVAL-Server (P/N 065500)

    conga-HPC/EVAL-Server

    Memory

    DDR4-UDIMM-3200 (16GB) (P/N 069000)

    DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM

    DDR4-UDIMM-3200 ECC (16GB) (P/N 069003)

    DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM

    DDR4-UDIMM-3200 (16GB) / i-temp (P/N 069002)

    Industrial DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM

    DDR4-UDIMM-3200 ECC (16GB) / i-temp (P/N 069004)

    Industrial DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM

    DDR4-UDIMM-3200 (32GB) (P/N 069001)

    DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM

    DDR4-UDIMM-3200 ECC (32GB) (P/N 069006)

    DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM

    DDR4-UDIMM-3200 (32GB) / i-temp (P/N 069005)

    Industrial DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM

    DDR4-UDIMM-3200 ECC (32GB) / i-temp (P/N 069007)

    Industrial DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM

    DDR4-RDIMM-3200 ECC (16GB) (P/N 069200)

    DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM

    DDR4-RDIMM-3200 ECC (16GB) / i-temp (P/N 069210)

    Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM

    DDR4-RDIMM-3200 ECC (32GB) (P/N 069220)

    DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM

    DDR4-RDIMM-3200 ECC (32GB) / i-temp (P/N 069230)

    Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM

    DDR4-RDIMM-3200 ECC (64GB) (P/N 069240)

    DDR4 ECC RDIMM memory module with up to 3200 MT/s and 64GB RAM

    DDR4-RDIMM-3200 ECC (64GB) / i-temp (P/N 069250)

    Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 64GB RAM

    VLP DDR4-RDIMM-3200 ECC (16GB) (P/N 069600)

    DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM

    VLP DDR4-RDIMM-3200 ECC (16GB) / i-temp (P/N 069610)

    Industrial DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM

    VLP DDR4-RDIMM-3200 ECC (32GB) (P/N 069620)

    DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 32GB RAM

    Module services

    Design-In Training (P/N 27000001)

    Design-Training to develop carrier boards for Computer on Modules

    Ext. temperature screening (-40°C to +85°C) (P/N )

    congatec Wide Temperature Range Screening
    Standard screening profile with 12h temperature screening and cold soak test
    Including functional test and several boot-ups (before & after screening)

    Ext. temperature screening (-25°C to +80°C) (P/N )

    congatec Wide Temperature Range Screening
    Standard screening profile with 12h temperature screening and cold soak test
    Including functional test and several boot-ups (before & after screening)

    Accessories

    More about conga-HPC/EVAL-Server

    conga-HPC/EVAL-Server

    Evaluation Carrier Board for COM-HPC Server Type Modules

    More about conga-HPC/uATX-Server

    conga-HPC/uATX-Server

    Application Carrier Board for COM-HPC Server Type Modules (Size D)