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conga-TCRP1

COM Express® Compact Module based on AMD RYZEN™ AI Embedded P100 Series

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                  Value adding ecosystem offerings


                  Virtualization

                  Operating Systems

                  IOT Software

                  Cooling Solutions

                  Memory

                  Carrierboards

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                  conga-TCRP1

                  COM Express® Compact | Type 6 connector pinout based on AMD Ryzen™ AI Embedded P100 Series

                  Learn all about COMs - download the guide

                  • AMD Zen5/5c CPU Cores
                  • AMD Radeon™ RDNA™ 3.5 Graphics
                  • AMD XDNA™ 2 NPU
                  • TDP Range from 15W to 54W
                  • Onboard NVMe™ SSD (option)
                  Congatec Logo
                  Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

                  Value adding ecosystem offerings

                  Virtualization

                  Operating Systems

                  IOT Software

                  Cooling Solutions

                  Memory

                  Carrierboards

                  Module services

                  Specification

                  Formfactor
                  COM Express Compact
                  CPU
                  AMD Ryzen™ AI Embedded P132 (6 x 4.5 GHz, 8 MB cache, 28 W)
                  AMD Ryzen™ AI Embedded P121 (4 x 4.4 GHz, 8 MB cache, 28 W)
                  AMD Ryzen™ AI Embedded P132i (6 x 4.5 GHz, 8 MB cache, 28 W)
                  AMD Ryzen™ AI Embedded P121i (4 x 4.5 GHz, 8 MB cache, 28 W)
                  DRAM
                  2 SODIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) | up to 5600 MT/s | ECC supported
                  Ethernet
                  2.5 GbE via Intel® i226 Ethernet controller series
                  I/O Interfaces
                  4 x USB 3.2 Gen2
                  4 x USB 2.0
                  2 x SATA 6Gb/s (if NVMe™ SSD option is not used)
                  8 x PCIe Gen4
                  PEG x4 Gen4
                  1 x I²C bus
                  1 x GPSPI
                  2 x UART
                  8 x GPIO
                  1 x SM-Bus
                  1 x LPC
                  Mass storage
                  NVMe™ SSD up to 512 GB capacity (option instead of SATA ports)
                  Graphics
                  Integrated AMD Radeon™ RDNA™ 3.5 Graphics with up to 4x CUs (Compute Units)
                  NPU/AI Acceleration
                  Integrated XDNA 2™ NPU with up to 50 TOPs
                  congatec Board Controller
                  Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
                  embedded BIOS Features
                  AMI Aptio® UEFI firmware
                  32 Mbyte serial SPI with congatec Embedded BIOS feature
                  OEM Logo
                  OEM CMOS Defaults
                  LCD Control
                  Display Auto Detection
                  Backlight Control
                  Flash Update
                  Security
                  Trusted Platform Module (TPM 2.0)
                  Power Management
                  ACPI 6.0 with battery support
                  Operating Systems
                  Microsoft® Windows 11
                  Microsoft® Windows 11 IoT Enterprise
                  Linux
                  Hypervisor
                  RTS Real-Time Hypervisor
                  Temperature
                  Commercial variants: Operation: 0° to +60°C | Storage: -20° to +80°C
                  Industrial variants: Operation: -40° to +85°C | Storage: -40° to +85°C
                  Humidity
                  Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
                  Video Interfaces
                  Up to 3x DDI
                  LVDS or eDP
                  4 x independent displays
                  Size
                  95 x 95 mm (3,74" x 3,74")

                  Documents

                  All documents found on this page are updated without notification. Always check this page for the latest version.

                  Data Sheet

                  conga-TCRP1.pdf
                  12.01.2026

                  Whitepaper

                  The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

                  Product Variants

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                      There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
                      If you don't find the configuration you require contact your congatec Sales representative for further assistance.
                      conga-TCRP1/P132 (P/N 051803)

                      COM Express Compact module based on AMD Ryzen™ AI Embedded P132 processor with 6 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C

                      conga-TCRP1/P121 (P/N 051804)

                      COM Express Compact module based on AMD Ryzen™ AI Embedded P121 processor with 4 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C

                      conga-TCRP1/P132i (P/N 051813)

                      COM Express Compact module based on AMD Ryzen™ AI Embedded P132i processor with 6 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C

                      conga-TCRP1/P121i (P/N 051803)

                      COM Express Compact module based on AMD Ryzen™ AI Embedded P121i processor with 4 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C

                      Ecosystem Details

                      Virtualization

                      Hypervisor (P/N 300501)

                      Operating Systems

                      ctrlX OS (P/N 300020 )
                      Ubuntu Pro (P/N N/A)

                      IOT Software

                      Application Manager (P/N 300201)
                      COM Manager (P/N 300200)
                      Fleet Manager (P/N 300202)
                      Cloud Connector (P/N 300203)

                      Cooling Solutions

                      conga-TCRP1/CSA-HP-B (P/N 051850)

                      Standard active cooling solution for high performance COM Express module conga TCRP1 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

                      conga-TCRP1/CSA-HP-T (P/N 051851)

                      Standard active cooling solution for high performance COM Express module conga TCRP1 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.

                      conga-TCRP1/CSP-HP-B (P/N 051852)

                      Standard passive cooling solution for high performance COM Express module conga TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

                      conga-TCRP1/CSP-HP-T (P/N 051853)

                      Standard passive cooling solution for high performance COM Express module conga TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded.

                      conga-TCRP1/HSP-HP-B (P/N 051854)

                      Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

                      conga-TCRP1/HSP-HP-T (P/N 051855)

                      Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded.

                      Memory

                      DDR5-SODIMM-5600 (8GB) (P/N 068930)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C

                      DDR5-SODIMM-5600 (16GB) (P/N 068931)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C

                      DDR5-SODIMM-5600 (32GB) (P/N 068932)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C

                      DDR5-SODIMM-5600 (48GB) (P/N 068933)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C

                      DDR5-SODIMM-5600 ECC (16GB) (P/N 68941)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C

                      DDR5-SODIMM-5600 ECC (32GB) (P/N 68942)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C

                      DDR5-SODIMM-5600 ECC (48GB) (P/N 68943)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial temp 0°C to +60°C

                      DDR5-SODIMM-5600 (8GB) / i-temp (P/N 068935)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, industrial temp -40°C to +85°C

                      DDR5-SODIMM-5600 (16GB) / i-temp (P/N 068936)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, industrial temp -40°C to +85°C

                      DDR5-SODIMM-5600 (32GB) / i-temp (P/N 068937)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, industrial temp -40°C to +85°C

                      DDR5-SODIMM-5600 (48GB) / i-temp (P/N 068938)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, industrial temp -40°C to +85°C

                      DDR5-SODIMM-5600 ECC (16GB) / i-temp (P/N 068946)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, industrial temp -40°C to +85°C

                      DDR5-SODIMM-5600 ECC (32GB) / i-temp (P/N 068947)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, industrial temp -40°C to +85°C

                      DDR5-SODIMM-5600 ECC (48GB) / i-temp (P/N 068948)

                      DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, industrial temp -40°C to +85°C

                      Carrierboards

                      conga-TEVAL/COMe 3.0 (P/N 065821)

                      congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.0 specification. Industrial temperature range -40°C to 85°C.

                      Module services

                      Design-In Training (P/N 27000001)

                      Design-Training to develop carrier boards for Computer on Modules

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