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conga-HPC/mPTL

COM-HPC Mini module based on Intel® Core™ Ultra Processors Series 3

Ausgewählte Modulvariante

    Ausgewählte Ecosystem Parts

    Virtualization

      Operating Systems

        IOT Software

          Cooling Solutions

            Carrierboards

              Module services

                Zusätzliche Ecosystem Parts


                Virtualization

                Operating Systems

                IOT Software

                Cooling Solutions

                Carrierboards

                Module services

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                conga-HPC/mPTL

                COM-HPC Mini Module based on Intel® Core™ Ultra Processors Series 3 (Panther Lake-H)

                Learn all about COMs - download the guide

                • Intel® performance hybrid design with up to 16 cores
                • Integrated NPU for dedicated AI acceleration
                • Onboard LPDDR5x with in-band ECC on selected product variants
                • Onboard NVMe SSD with 128GB 
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                Wollen Sie noch weitere Produkte aus unserem Ecosystem (zB. Carrierboards oder Arbeitsspeicher) zu Ihrer Anfrage hinzufügen?

                Zusätzliche Ecosystem Parts

                Virtualization

                Operating Systems

                IOT Software

                Cooling Solutions

                Carrierboards

                Module services

                Spezifikation

                Formfactor
                COM-HPC
                CPU
                Intel® Core™ Ultra 5 325 (8 x 4.5 GHz, 12MB cache, 25W)
                Intel® Core™ Ultra 5 336H (12 x 4.6 GHz, 18MB cache, 25W)
                Intel® Core™ Ultra 7 356H (16 x 4.7 GHz, 18MB cache, 25W)
                Intel® Core™ Ultra 7 366H (16 x 4.8 GHz, 18MB cache, 25W)
                Intel® Core™ Ultra X7 368H (16 x 5.0 GHz, 18MB cache, 25W)
                Intel® Core™ Ultra 9 386H (16 x 4.9 GHz, 18MB cache, 25W)
                DRAM
                Up to 32 GB LPDDR5x soldered down (optional up to 96 GB) with max. 8.533 MT/s | dual channel | in-band ECC support on selected SKUs
                Ethernet
                2 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series (TSN only on selected PNs)
                I/O Interfaces
                4 x x1 PCIe Gen4
                1 x x4 PCIe Gen5
                2 x x4 PCIe Gen5 on selected SKUs
                USB4 (USB4 would be disabled if second DP/DP++ was enabled by separate BIOS)
                Up to 4x USB 3.2 Gen2x1
                Up to 8x USB 2.0
                2 x UART
                GPSPI
                eSPI
                SM-Bus
                FAN Control
                12 x GPIO
                Mass storage
                NVMe SSD with 128GB (optional up to 1 TB capacity)
                Graphics
                Intel® Arc Graphics with up to 12 Xe cores or Intel Graphics with up to 4 Xe cores | Intel® Xe Matrix Extensions
                NPU/AI Acceleration
                Integrated NPU accelerator with up to 50 TOPS
                congatec Board Controller
                Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code
                embedded BIOS Features
                AMI Aptio® UEFI firmware
                32 Mbyte serial SPI with congatec Embedded BIOS feature
                OEM Logo
                OEM CMOS Defaults
                LCD Control
                Display Auto Detection
                Backlight Control
                Flash Update
                Security
                Trusted Platform Module (TPM 2.0)
                Power Management
                ACPI 6.0 with battery support
                Operating Systems
                Microsoft® Windows 11
                Microsoft® Windows 11 IoT Enterprise
                Linux
                Yocto
                Hypervisor
                RTS Real-Time Hypervisor
                Temperature
                Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
                Humidity
                Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
                Video Interfaces
                DP/DP++
                eDP
                Size
                95 x 70 mm

                Dokumente

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                Data Sheet

                Data Sheet for conga-HPC/mPTL
                18.12.2025

                Whitepaper

                The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

                Produktvarianten

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                    Sollte Ihre gewünschte Konfiguration in unserem Filter nicht erscheinen, kontaktieren Sie bitte unseren Vertrieb für weiterführende Hilfe.
                    conga-HPC/mPTL-9-386H-32G NVMe128 (P/N 045800)

                    COM-HPC Mini module based on Intel® Core™ Ultra 9 386H processor with 4 P-cores, 8 E-cores and 4 LPE Cores | Integrated NPU | 18 MB Intel® Smart Cache LLC | Intel Graphics with 4Xe Cores | 32GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H

                    conga-HPC/mPTL-X7-368H-32G NVMe128 (P/N 045801)

                    COM-HPC Mini module based on Intel® Core™ Ultra X7 368H processor with 4 P-cores, 8 E-cores and 4 LPE Cores | Integrated NPU | 18 MB Intel® Smart Cache LLC | Intel® Arc™ B390 Graphics with 12Xe Cores | 32GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H

                    conga-HPC/mPTL-7-366H-16G NVMe128 (P/N 045802)

                    COM-HPC Mini module based on Intel® Core™ Ultra 7 366H processor with 4 P-cores, 8 E-cores and 4 LPE Cores | Integrated NPU | 18 MB Intel® Smart Cache LLC | Intel Graphics with 4Xe Cores | 16GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H

                    conga-HPC/mPTL-7-356H-16G NVMe128 (P/N 045803)

                    COM-HPC Mini module based on Intel® Core™ Ultra 7 356H processor with 4 P-cores, 8 E-cores and 4 LPE Cores | Integrated NPU | 18 MB Intel® Smart Cache LLC | Intel Graphics with 4Xe Cores | 16GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H

                    conga-HPC/mPTL-5-336H-16G NVMe128 (P/N 045804)

                    COM-HPC Mini module based on Intel® Core™ Ultra 5 336H processor with 4 P-cores, 4 E-cores and 4 LPE Cores | Integrated NPU | 18 MB Intel® Smart Cache LLC | Intel Graphics with 4Xe Cores | 16GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H

                    conga-HPC/mPTL-5-325-16G NVMe128 (P/N 045805)

                    COM-HPC Mini module based on Intel® Core™ Ultra 5 325 processor with 4 P-cores and 4 LPE Cores | Integrated NPU | 12 MB Intel® Smart Cache LLC | Intel Graphics with 4Xe Cores | 16GB onboard LPDDR5x memory | 128GB onboard NVMe | Intel code name Panther Lake-H

                    Ecosystem Details

                    Virtualization

                    Hypervisor (P/N 300501)

                    Operating Systems

                    ctrlX OS (P/N 300020 )
                    Ubuntu Pro (P/N N/A)

                    IOT Software

                    Application Manager (P/N 300201)
                    COM Manager (P/N 300200)
                    Cloud Connector (P/N 300203)

                    Cooling Solutions

                    conga-HPC/mPTL-CSA-B (P/N 045850)

                    Standard active cooling solution for COM-HPC module conga-HPC/mPTL with 24.8mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

                    conga-HPC/mPTL-CSA-T (P/N 045851)

                    Standard active cooling solution for COM-HPC module conga-HPC/mPTL with 24.8mm overall heat sink height and integrated 12V fan. All standoffs are M2.5 threaded.

                    conga-HPC/mPTL-CSP-B (P/N 045852)

                    Standard passive cooling solution for COM-HPC module conga-HPC/mPTL with 24mm overall heat sink height. All standoffs are with 2.7mm bore hole.

                    conga-HPC/mPTL-CSP-T (P/N 045853)

                    Standard passive cooling solution for COM-HPC module conga-HPC/mPTL with 24mm overall heat sink height. All standoffs are M2.5 threaded.

                    conga-HPC/mPTL-HSP-B (P/N 045854)

                    Standard heatspreader for COM-HPC module conga-HPC/mPTL. All standoffs are with 2.7mm bore hole.

                    conga-HPC/mPTL-HSP-T (P/N 045855)

                    Standard heatspreader for COM-HPC module conga-HPC/mPTL. All standoffs are M2.5 threaded.

                    Carrierboards

                    conga-HPC/EVAL-Mini (P/N 065640)

                    Evaluation Carrier Board for COM-HPC Mini modules.

                    conga-HPC/3.5-Mini (P/N 065630)

                    COM-HPC Client 3.5” carrier board suitable for congatec COM-HPC Mini modules

                    Module services

                    Design-In Training (P/N 27000001)

                    Design-Training to develop carrier boards for Computer on Modules

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