Let’s meet at Automate 2026
June 22 - 25, 2026
Let’s meet at Automate 2026, the global platform and place to be for the entire embedded community, in Chicago, IL from June 22nd to 25th.
Our focus this year is our aReady. portfolio - a comprehensive ecosystem of embedded hardware and software building blocks, and tailored services. Visit us at our booth to discover how this application-ready approach simplifies design-in complexity and accelerates your time-to-market by providing a unified, pre-validated foundation for your edge applications.
Our hardware buildings block based on COM-HPC, COM Express, and SMARC, along with software and service building blocks, are an integral part of our aReady. strategy, enabling smarter, more energy-efficient, future-ready, and secure embedded systems.
This is what you can expect at our booth
Here is what we can tell you so far…
New Intel® Core™ Ultra Series 3 modules
Our ecosystem is extended with the industry’s broadest portfolio of Computer-on-Modules based on Intel® Core™ Ultra Series 3 (Panther Lake), delivering up to 180 TOPS of integrated AI acceleration with strong power efficiency for embedded applications.
High-performance Arm ecosystem
Our Arm ecosystem is extended with our first COM-HPC Mini featuring Qualcomm Dragonwing IQ-X, offering exceptional AI performance and power efficiency for edge applications.
Efficient entry into rugged embedded edge AI
congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series.
Application-ready hardware and software building blocks simplifying AI, IoT, and security integration for faster time-to-market.
From modular building blocks to fully-certified systems – designed with trusted partners.
Explore now
