COM Express Type 6 Compact module with Intel® Core™ i7-6600U dual core processor with 2.6GHz, 4MB L2 cache and 2133MT/s dual channel DDR4 memory interface
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conga-TC170 (EOL)
COM Express Type 6 Compact module based on 6th Generation Intel® Core™ processor family
- 第 6 代Intel® Core™ ULV 处理器
- Intel® 第 9 代高清显卡,支持HEVC (H.265)
- 32 GB 双通道 DDR4 内存
Specification
with OpenCL 2.0, OpenGL 4.3 and DirectX12 (Windows 10) support | up to three independent displays: DisplayPort 1.2 | eDP 1.3 | VGA (optional)
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Data Sheet
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos direct 3.1.0 and newer!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos direct 3.1.0 and newer!
Product Variants
COM Express Type 6 Compact module with Intel® Core™ i5-6300U dual core processor with 2.4GHz, 3MB L2 cache and 2133MT/s dual channel DDR4 memory interface
COM Express Type 6 Compact module with Intel® Core™ i3-6100U dual core processor with 2.3GHz, 3MB L2 cache and 2133MT/s dual channel DDR4 memory interface
COM Express Type 6 Compact module with Intel® Core™ i7-6600U dual core processor with 2.6GHz up to 3.4GHz, 4MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-U). Integrated DisplayPort to VGA converter.
COM Express Type 6 Compact module with Intel® Celeron® 3955U dual core processor with 2.0GHz, 2MB L2 cache and 2133MT/s dual channel DDR4 memory interface
Ecosystem Details
Cooling Solutions
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
Memory
DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Module services
Design-Training to develop carrier boards for Computer on Modules
HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-LDVI
适用于LVDS的DVI转换模块
conga-TEVAL/COMe 2.1 (EOL)
COM Express Type 6模块评估载板













