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conga-TC1000

COM Express Type 6 Compact Module based on Intel® Core™ Ultra Processors Series 3 (Panther Lake-H)

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          conga-TC1000

          COM Express Type 6 Compact Module based on Intel® Core™ Ultra Processors Series 3 (Panther Lake-H)

          Learn all about COMs - download the guide

          • Intel® performance hybrid architecture with up to 16 cores
          • Intel® Arc™ Graphics or Intel Graphics
          • Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance
          • DDR5 SODIMM with up to 128 GB RAM system capacity 
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          Cooling Solutions

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          Specification

          Formfactor
          COM Express Compact
          CPU
          Intel® Core™ Ultra X7 358H (4 P-cores, 8 E-cores and 4 LPE-cores)
          Intel® Core™ Ultra X9 388H (4 P-cores, 8 E-cores and 4 LPE Cores)
          Intel® Core™ Ultra 5 325 (4 P-cores and 4 LPE Cores )
          Intel® Core™ Ultra 5 336H (4 P-cores, 4 E-cores and 4 LPE Cores)
          Intel® Core™ Ultra 7 356H (4 P-cores, 8 E-cores and 4 LPE-cores)
          Intel® Core™ Ultra 7 366H (4 P-cores, 8 E-cores and 4 LPE Cores)
          Intel® Core™ Ultra 9 386H (4 P-cores, 8 E-cores and 4 LPE-Cores)
          DRAM
          2x SO-DIMM sockets for DDR5 memory modules up to 64 GB each (max. 128 GB RAM system capacity) | up to 7200 MT/s | in-band ECC band ECC (only on selected product variants)
          Ethernet
          2.5 GbE via Intel® i226 Ethernet controller series | Supporting TSN – Time Sensitive Networking (depending on PN) | Software Definable Pin (SDP) to be used for IEEE 1588
          I/O Interfaces
          Up to 12x PCIe Gen4 PEG (H484) or up to 4x PCIe Gen4 PEG (H12Xe, H404)
          up to 8x PCIe Gen4
          up to 2x USB4
          3x USB 3.2 Gen2 (incl. USB 2.0) + 8x USB 2.0
          2x SATA (flexible multiplexing)
          2 x UART
          GPIOs
          GPSPI
          LPC
          SM-Bus
          I²C
          Mass storage
          NVMe x4 SSD (optional) up to 1 TB capacity
          Graphics
          Intel® Arc Graphics with up to 12 Xe cores or Intel Graphics with up to 4 Xe cores | Intel® Xe Matrix Extensions
          NPU/AI Acceleration
          Integrated NPU accelerator 50 TOPS | Up to 180 TOPS platform total
          congatec Board Controller
          Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code
          embedded BIOS Features
          AMI Aptio® UEFI firmware
          64Mbyte serial SPI with congatec Embedded BIOS feature
          OEM Logo
          OEM CMOS Defaults
          LCD Control
          Display Auto Detection
          Backlight Control
          Flash Update
          Security
          Trusted Platform Module (TPM 2.0) through Infineon SLB9672
          Power Management
          ACPI 6.0 with battery support
          Operating Systems
          Microsoft® Windows 11 IoT Enterprise LTSC
          Microsoft® Windows 11
          Linux
          Yocto
          Hypervisor
          RTS Real-Time Hypervisor
          Temperature
          Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
          Humidity
          Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
          Video Interfaces
          Up to 3x DDI (2x shared with USB4)
          LVDS or eDP
          4 x independent displays up to 8k
          Size
          95 x 95 mm (3,74" x 3,74")

          Documents

          All documents found on this page are updated without notification. Always check this page for the latest version.

          Data Sheet

          Data Sheet for conga-TC1000
          18.12.2025

          Whitepaper

          The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

          Product Variants

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              There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
              If you don't find the configuration you require contact your congatec Sales representative for further assistance.
              conga-TC1000/ultraX9-388H (P/N 052000)

              COM Express Compact module based on Intel® Core™ Ultra X9 388H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel® Arc™ B390 Graphics with 12Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C

              conga-TC1000/ultra9-386H (P/N 052001)

              COM Express Compact module based on Intel® Core™ Ultra 9 386H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C

              conga-TC1000/ultraX7-358H (P/N 052002)

              COM Express Compact module based on Intel® Core™ Ultra X7 358H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel® Arc™ B390 Graphics with 12Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C

              conga-TC1000/ultra7-356H (P/N 052003)

              COM Express Compact module based on Intel® Core™ Ultra 7 356H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C

              conga-TC1000/ultra7-355 (P/N 052004)

              COM Express Compact module based on Intel® Coreâ„¢ Ultra 7 355 processor with 4 P-cores and 4 LPE-cores | Integrated NPU | 12MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 6400 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C

              conga-TC1000/ultra5-336H (P/N 052005)

              COM Express Compact module based on Intel® Core™ Ultra 5 336H processor with 4 P-cores, 4 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C

              conga-TC1000/ultra5-325 (P/N 052006)

              COM Express Compact module based on Intel® Core™ Ultra 5 325 processor with 4 P-cores and 4 LPE-cores | Integrated NPU | 12MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 6400 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C

              conga-TC1000/ultra7-366H (P/N 052007)

              COM Express Compact module based on Intel® Core™ Ultra 7 366H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | Dual channel SODIMM DDR5 memory interface with up to 7200 MT/s and up to 128 GB system memory capacity | Commercial grade temperature range from 0°C to 60°C

              Ecosystem Details

              Cooling Solutions

              conga-TC1000/CSA-HP-B (P/N 052050)

              Standard active cooling solution for high performance COM Express module conga-TC1000 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

              conga-TC1000/CSA-HP-T (P/N 052051)

              Standard active cooling solution for high performance COM Express module conga-TC1000 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.

              conga-TC1000/CSP-HP-B (P/N 052052)

              Standard passive cooling solution for high performance COM Express module conga-TC1000 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole.

              conga-TC1000/CSP-HP-T (P/N 052053)

              Standard passive cooling solution for high performance COM Express module conga-TC1000 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded.

              conga-TC1000/HSP-HP-B (P/N 052054)

              Standard heatspreader for high performance COM Express module conga-TC1000 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole.

              conga-TC1000/HSP-HP-T (P/N 052055)

              Standard heatspreader for high performance COM Express module conga-TC1000 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded.

              Carrierboards

              conga TEVAL/ COMe 3.1 (P/N 065820)

              Evaluation carrier board for COM Express Type 6 revision 3.1 modules.

              Memory

              DDR5-SODIMM-7200 (8GB) (P/N 068960)

              DDR5 SODIMM memory module with up to 7200 MT/s and 8GB RAM, commercial temp 0°C to +60°C

              DDR5-SODIMM-7200 (16GB) (P/N 068961)

              DDR5 SODIMM memory module with up to 7200 MT/s and 16GB RAM, commercial temp 0°C to +60°C

              DDR5-SODIMM-7200 (32GB) (P/N 068962)

              DDR5 SODIMM memory module with up to 7200 MT/s and 32GB RAM, commercial temp 0°C to +60°C

              DDR5-SODIMM-7200 (48GB) (P/N 068963)

              DDR5 SODIMM memory module with up to 7200 MT/s and 48GB RAM, commercial temp 0°C to +60°C

              DDR5-SODIMM-7200 (64GB) (P/N 068964)

              DDR5 SODIMM memory module with up to 7200 MT/s and 64GB RAM, commercial temp 0°C to +60°C

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