Simplifying the use of embedded technology – congatec @ embedded world 2026
March 10th - 12th | Hall 3 - Booth 241
Let’s meet at embedded world 2026, the global platform and place to be for the entire embedded community, in Nuremberg, Germany from March 10th to March 12th. Use our voucher code ew26561782 to secure your free entry!
In 2026, we’re going bigger! Following our investment in JUMPtec - the former module business of Kontron AG - you will find even more modules, application examples and services at our booth.
Visit congatec in Hall 3, Booth 241 and experience our application-ready embedded computing portfolio - combining aReady. Computer-on-Modules, software, and services into one coherent ecosystem.
Our hardware buildings block based on COM-HPC, COM Express, and SMARC, along with software and service building blocks, are an integral part of our aReady. strategy, enabling smarter, more energy-efficient, future-ready, and secure embedded systems.
This is what you can expect at our booth (or at least what we can already tell you about – more announcements coming soon):
Here is what we can tell you so far…
New Intel® Core™ Ultra Series 3 modules
Our ecosystem is extended with the industry’s broadest portfolio of Computer-on-Modules based on Intel® Core™ Ultra Series 3 (Panther Lake), delivering up to 180 TOPS of integrated AI acceleration with strong power efficiency for embedded applications.
High-performance Arm ecosystem
Our Arm ecosystem is extended with our first COM-HPC Mini featuring Qualcomm Dragonwing IQ-X, offering exceptional AI performance and power efficiency for edge applications.
Efficient entry into rugged embedded edge AI
congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series.
Application-ready hardware and software building blocks simplifying AI, IoT, and security integration for faster time-to-market.
More coming soon
New topics and updates will be revealed at the show.
Subscribe to our newsletter and don’t miss what’s next.
