COM-HPC-mini
This COM-HPC standard provides
highest performance to
small form factor designs
功能概要
小尺寸(SFF) 尺寸
基于COM-HPC客户端(Client)的规格，尺寸仅为95mmx70mm，COM-HPC Mini的尺寸是COM-HPC Client Size A的一半。因此，COM-HPC Mini将COM-HPC客户端的使用模式扩展到以前由于尺寸限制而无法解决的应用。最小化所需的footprint，并对接口轻微改变，因此COM-HPC Mini模块与客户端和服务器的规格不兼容。最重要的变化是只使用一个高速连接器而不是两个。这个连接器还带有不同的引脚，以提供一个优化的功能集。因此，通过400个信号引脚，COM-HPC Mini可以传输各种最新的高带宽接口--包括功能齐全的USB 4.0、Thunderbolt、PCIe Gen4/5以及10 Gbit/s以太网和更多。
PICMG COM-HPC技术小组委员会在2022年底批准COM-HPC Mini引脚定义，这对规范制定过程来说已达成重要里程碑。随着引脚的批准，活跃在COM-HPC工作组的载板设计者和计算机模块制造商已经开始了第一个模块和开发载板的设计，这样，开发人员就可以开始评估其应用与开发，并在规范发布后立即转换为完全符合要求的组件。COM-HPC Mini标准的最终批准定于2023年上半年。更多最新信息, 请拜访PICMG COM-HPC网页 https://www.picmg.org/openstandards/com-hpc/
conga-HPC/3.5-Mini
- Compact Application Carrier for COM-HPC Mini Modules
- Scalable 3.5” motherboard
- Longevity by module concept
- Quick start for COM-HPC Mini designs
Everything you need to know about COMs
Computer-on-Modules (COMs) power everything from robotics and medical devices to edge computing and smart mobility. But what makes them so versatile? And which standard is right for your needs? Explore the answers in our comprehensive guide to COMs.
Wireless TSN
Wireless Time Sensitive Networking (WTSN) enables deterministic, low-latency communication and real-time synchronization over standard Wi-Fi Ethernet extending real-time communication to autonomous and mobile applications. The first standardized modules are already simplifying the design-in of this upcoming standard.
Introduction to workload consolidation
Leveraging multicore processors and virtualization, you can consolidate multiple tasks onto a single platform, where each task operates securely and independently from each other. This is an effective way to reduce costs and complexity in embedded applications.
