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conga-TM67 (EOL)
High Performance COM Express™ Basic Type 6 Module with Socketed Intel® Core™ i7 Processors
- High Performance COM Express Basic Type 6 Module
- Up to Intel® Core™ i7 quad core processor
- Heat Pipe Cooling Solutions
Specification
Low Power Intel® Core™ i7 2.2GHz processor
Documents
Manual
Data Sheet
Application Note
Image
Software
Product Variants
Ecosystem Details
Cooling solutions
Standard active cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Standard active cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Standard heatspreader for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
Accessories
conga-FPA2 (EOL)
Universal Flat Panel Adapter Board
conga-TEVAL/COMe 2.1 (EOL)
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 2.1
conga-LDVI
DVI Converter Module for LVDS