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conga-TM67 (EOL)
Módulo COM Express™ Básico, Tipo 6, de alto rendimiento con procesadores Intel® Core™ i7 con zócalo
- Módulo COM Express Básico, Tipo 6, de alto rendimiento
- Hasta procesador Intel® Core™ i7 de cuatro núcleos
- Soluciones de refrigeración con tubos de calor
Specification
Low Power Intel® Core™ i7 2.2GHz processor
Documents
Manual
Application Note
Image
Data Sheet
Software
Product Variants
Ecosystem Details
Cooling solutions
Standard heatspreader for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard active cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
Accessories
conga-FPA2 (EOL)
Placa adaptadora universal para pantallas planas
conga-LDVI
Módulo convertidor a DVI para LVDS
conga-TEVAL/COMe 2.1 (EOL)
Placa base de evaluación para módulos COM Express® Tipo 6