SAN DIEGO, CA — November 12, 2026 * * * congatec — a leading vendor of embedded and edge computing technology — today voiced support for the PICMG COM-HPC® Carrier Design Guide, Rev. 2.3, a 173-page document that provides updated practical guidance to electronics engineers and printed circuit board (PCB) layout engineers designing custom carrier boards for the Computer-on-Module (COM) high-performance computing (HPC) standard.
“As a form-factor standard that defines extremely high I/O and computer performance levels for small form-factor physical AI applications all the way up to embedded servers and workstations, COM-HPC has proven extremely successful since PICMG first ratified it in 2021,” said Christian Eder, chairman of the COM-HPC working group and director of market intelligence, congatec. “congatec has continued to play a pivotal role in developing and actualizing the COM-HPC standard from the start. And we are fully committed to supporting the standard in all stages of its evolution.
“This includes our support for the PICMG COM-HPC Carrier Design Guide, Rev. 2.3. This guide provides OEMs with comprehensive technical details for developing secure, application-specific carrier or baseboards that offer all the benefits of open standards — including flexible design choices,” added Eder.
About the PICMG Carrier Design Guide, Rev. 2.3
The COM-HPC Carrier Design Guide, Rev. 2.3 clarifies the slight modifications needed to apply COM-HPC Client examples to COM-HPC Mini designs. It should be used in combination with the COM-HPC Base Specification, with other industry specifications (listed in Section 1.9. of the new design guide), with silicon and component vendors’ documentation, and with COM-HPC module vendors’ product documentation.
The design guide is available for free download from the PICMG website: Download
