conga-B7AC

• Intel Atom® C3000 processor family
• Up to 16 cores
• Extended temperature options
• Power-optimized design
• 4x 10 GbE with KR interface support

conga-B7E3

• AMD EPYC™ Embedded 3000 Series
• Up to 16 cores
• Up to 96 GB RAM
• Extended temperature options
• 4x 10 GbE with KR interface support

conga-B7XD

• Intel® Xeon® D1500 and Intel® Pentium® processors
• Up to 16 cores
• Up to 96 GB RAM
• Optional ECC support
• 2x 10 GbE with KR interface support

conga-B7XI

• Intel® Xeon® D1700 processors
• Up to 10 cores
• Up to 128 GB RAM
• Extended temperature options
• Up to 4x 10 GbE supporting CEI/KR/SFI

conga-HPC/cRLP

• 13th Generation Intel® Core™
• Intel® performance hybrid architecture
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 5

conga-HPC/cRLS

• 13th Generation Intel® Core™
• Intel® performance hybrid architecture
• Performance-optimized design
• Up to 24 cores
• PCIe Gen 5

conga-HPC/cTLH

• 11th Generation Intel® Core™
• Intel® Xe graphics engine
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 4

conga-HPC/cTLU​

• 11th Generation Intel® Core™
• Power- and size-optimized design
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 4

conga-HPC/mRLP

• 13th Generation Intel® Core™
• Intel® Xe graphics engine
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 4

conga-HPC/sILH

• Intel® Xeon® D2700 processors
• Up to 20 cores
• Up to 1 TB RAM
• Ext. temp. options
• 100 Gb max. Ethernet bandwidth

conga-HPC/sILL

• Intel® Xeon® D1700 processors
• Up to 10 cores
• Up to 256 GB RAM
• Ext. temp. options
• 100 Gb max. Ethernet bandwidth

conga-IC370

Highest Performance Thin-Mini-ITX board based on 8th Generation Intel® Core™ Mobile Processors "Whiskey Lake"

conga-JC370

Highest Performance 3.5'' Single Board Computer based on 8th Generation Intel® Core™ processor series called "Whiskey Lake"

conga-MA5

• 5th Generation Intel® Pentium®, Celeron® and Atom® processors
• Rugged design with soldered processor and memory
• Quadcore technology
• Up to 4k display support
• Extended temperature support

conga-MA7

• Intel Atom®, Intel® Pentium® and Celeron®
• Rugged design with soldered processor and memory
• Real-time capable with TCC and TSN
• Inband ECC memory support
• Extended temperature support

conga-PA7

Pico-ITX SBC based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series

conga-QA3

• Quadcore Intel Atom® E38xx or Celeron® N/J
• 9 variants for broad scalability
• Intel® I210 Gigabit Ethernet controller
• Up to 8 GB DDR3L
• Industrial temperature support

conga-QA5

• Intel Atom® x7 Intel® Pentium® or Celeron® J
• 6 variants for broad scalability
• GbE with TSN and TCC support
• Up to 8 GB LPDDR4
• Industrial temperature support

conga-QA7

• Intel Atom® x6000E, Intel® Pentium® or Celeron® J
• 8 variants for broad scalability
• GbE with TSN and TCC support
• Up to 16 GB LPDDR4x
• Industrial temperature support

conga-QMX6

• NXP i.MX6 application processor
• Up to quadcore Arm® Cortex®-A9
• 1x Arm Cortex®-M4F for real-time processing
• GC NanoUltra 3D graphics
• Industrial temperature support

conga-QMX8-Plus

• NXP i.MX 8M Plus processor
• Integrated Neural Processing Unit (NPU)
• Quadcore Arm® Cortex®-A53 / M7
• Up to 3 independent display outputs
• Industrial temperature support

conga-SA5

• Intel Atom® x7 Intel® Pentium® or Celeron® J
• 6 variants for broad scalability
• GbE with TSN and TCC support
• Up to 8 GB LPDDR4
• Industrial temperature support

conga-SA7

• Intel Atom® x6000E, Intel® Pentium® or Celeron® J
• 8 variants for broad scalability
• GbE with TSN and TCC support
• Up to 16 GB LPDDR4x
• Industrial temperature support

conga-SMX8-Mini

• NXP i.MX 8M Mini application processor
• Up to quadcore Arm® Cortex®-A35
• 1x Arm® Cortex®-M4F for real-time processing
• GC NanoUltra 3D graphics
• Industrial temperature support

conga-SMX8-Plus

• NXP i.MX 8M Plus application processor
• Integrated Neural Processing Unit (NPU)
• Quadcore Arm® Cortex®-A53 / M7
• Up to 3 independent display outputs
• Industrial temperature support

conga-SMX8-Plus embedded AI Vision Kit

congatec i.MX 8M Plus Vision Kit for AI and Machine Learning applications

conga-SMX8X

• NXP MX8-X application processor
• Ultra-low power design (2-5 W)
• Up to quadcore Arm® Cortex®-A35
• 1x Arm® Cortex®-M4F for real-time processing
• Industrial temperature support

conga-STDA4

• TI processor TDA4VM or DRA829J
• Dual Arm® Cortex®-A72
• Deep learning hardware accelerator
• Arm® Cortex®-R5F MCUs for real-time communication
• Industrial temperature support

conga-TC170

• 6th Generation Intel® Core™ and Celeron®
• Size-optimized design
• Low power consumption (TDP 15 W)
• Up to 2 cores
• Up to 32 GB DDR4 memory

conga-TC175

• 7th Generation Intel® Core™ and Celeron®
• Size-optimized design
• Low configurable power consumption (cTDP 7.5 W)
• Up to 2 cores
• Up to 32 GB DDR4 memory

conga-TC370

• 8th Generation Intel® Core™ and Celeron®
• Size- and power-optimized design
• Up to 4 cores
• Supports USB 3.1 Gen 2 (10 Gbit/sw)
• Up to 64 GB memory

conga-TC570

• 11th Generation Intel® Core™
• Compact design
• Up to 4 cores
• Extended temperature range options
• PCIe Gen 4

conga-TC570r

• 11th Generation Intel® Core™
• Extremely rugged with soldered memory
• Extended temperature range options
• IEC-60068 certified
• PCIe Gen 4

conga-TC675

• 13th Generation Intel® Core™
• Intel® Performance Hybrid Architecture
• Extended temperature range options
• Up to 14 cores
• PCIe Gen 4

conga-TCA5

• Intel Atom® x7-E, Intel® Pentium® and Celeron®
• Size-optimized design
• Low power consumption (12 W)
• Up to 4 cores
• Extended temperature range options

conga-TCA7

• Intel Atom® x6000E, Intel® Pentium® and Celeron®
• Cost- and power-optimized design
• Up to 4 cores
• Extended temperature range options
• Supports TSN and TCC

conga-TCV2

• AMD Embedded Ryzen V2000 processor series
• High-performance Vega 7 GPU
• Superior cost/performance ratio
• Up to 8 cores
• Wide TDP range from 10-54 W

conga-TR4

• AMD Embedded Ryzen V1000 processor series
• High-performance Vega GPU
• Supports up to 4x 4k
• Up to 4 cores
• Wide TDP range down to 12 W

conga-TS170

• 6th Generation Intel® Core™ and Xeon®
• Performance-optimized design
• Up to 4 cores
• Up to 32 GB DDR4
• ECC support for Intel® Xeon®

conga-TS175

• 7th Generation Intel® Core™ and Xeon®
• Performance-optimized design
• Up to 4 cores
• Up to 32 GB DDR4
• ECC support

conga-TS370

• 8th Generation Intel® Core™ and Xeon®
• Performance-optimized design
• Up to 6 cores
• Supports USB 3.1 Gen 2 (10 Gbit/sw)
• Up to 64 GB ECC memory

conga-TS570

• 11th Generation Intel® Core™
• Performance-optimized design
• Up to 8 cores
• Extended temperature range options
• PCIe Gen 4

conga-MEVAL

• Evaluation carrier board for COM Express Type 10
• 2x PCIe card slots for 5 lanes
• Schematics available on project basis

conga-B7AC

• Intel Atom® C3000 processor family
• Up to 16 cores
• Extended temperature options
• Power-optimized design
• 4x 10 GbE with KR interface support

conga-B7E3

• AMD EPYC™ Embedded 3000 Series
• Up to 16 cores
• Up to 96 GB RAM
• Extended temperature options
• 4x 10 GbE with KR interface support

conga-B7XD

• Intel® Xeon® D1500 and Intel® Pentium® processors
• Up to 16 cores
• Up to 96 GB RAM
• Optional ECC support
• 2x 10 GbE with KR interface support

conga-B7XI

• Intel® Xeon® D1700 processors
• Up to 10 cores
• Up to 128 GB RAM
• Extended temperature options
• Up to 4x 10 GbE supporting CEI/KR/SFI

conga-HPC/cRLP

• 13th Generation Intel® Core™
• Intel® performance hybrid architecture
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 5

conga-HPC/cRLS

• 13th Generation Intel® Core™
• Intel® performance hybrid architecture
• Performance-optimized design
• Up to 24 cores
• PCIe Gen 5

conga-HPC/cTLH

• 11th Generation Intel® Core™
• Intel® Xe graphics engine
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 4

conga-HPC/cTLU​

• 11th Generation Intel® Core™
• Power- and size-optimized design
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 4

conga-HPC/mRLP

• 13th Generation Intel® Core™
• Intel® Xe graphics engine
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 4

conga-HPC/sILH

• Intel® Xeon® D2700 processors
• Up to 20 cores
• Up to 1 TB RAM
• Ext. temp. options
• 100 Gb max. Ethernet bandwidth

conga-HPC/sILL

• Intel® Xeon® D1700 processors
• Up to 10 cores
• Up to 256 GB RAM
• Ext. temp. options
• 100 Gb max. Ethernet bandwidth

conga-IC370

Highest Performance Thin-Mini-ITX board based on 8th Generation Intel® Core™ Mobile Processors "Whiskey Lake"

conga-JC370

Highest Performance 3.5'' Single Board Computer based on 8th Generation Intel® Core™ processor series called "Whiskey Lake"

conga-MA5

• 5th Generation Intel® Pentium®, Celeron® and Atom® processors
• Rugged design with soldered processor and memory
• Quadcore technology
• Up to 4k display support
• Extended temperature support

conga-MA7

• Intel Atom®, Intel® Pentium® and Celeron®
• Rugged design with soldered processor and memory
• Real-time capable with TCC and TSN
• Inband ECC memory support
• Extended temperature support

conga-PA7

Pico-ITX SBC based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series

conga-QA3

• Quadcore Intel Atom® E38xx or Celeron® N/J
• 9 variants for broad scalability
• Intel® I210 Gigabit Ethernet controller
• Up to 8 GB DDR3L
• Industrial temperature support

conga-QA5

• Intel Atom® x7 Intel® Pentium® or Celeron® J
• 6 variants for broad scalability
• GbE with TSN and TCC support
• Up to 8 GB LPDDR4
• Industrial temperature support

conga-QA7

• Intel Atom® x6000E, Intel® Pentium® or Celeron® J
• 8 variants for broad scalability
• GbE with TSN and TCC support
• Up to 16 GB LPDDR4x
• Industrial temperature support

conga-QMX6

• NXP i.MX6 application processor
• Up to quadcore Arm® Cortex®-A9
• 1x Arm Cortex®-M4F for real-time processing
• GC NanoUltra 3D graphics
• Industrial temperature support

conga-QMX8-Plus

• NXP i.MX 8M Plus processor
• Integrated Neural Processing Unit (NPU)
• Quadcore Arm® Cortex®-A53 / M7
• Up to 3 independent display outputs
• Industrial temperature support

conga-SA5

• Intel Atom® x7 Intel® Pentium® or Celeron® J
• 6 variants for broad scalability
• GbE with TSN and TCC support
• Up to 8 GB LPDDR4
• Industrial temperature support

conga-SA7

• Intel Atom® x6000E, Intel® Pentium® or Celeron® J
• 8 variants for broad scalability
• GbE with TSN and TCC support
• Up to 16 GB LPDDR4x
• Industrial temperature support

conga-SMX8-Mini

• NXP i.MX 8M Mini application processor
• Up to quadcore Arm® Cortex®-A35
• 1x Arm® Cortex®-M4F for real-time processing
• GC NanoUltra 3D graphics
• Industrial temperature support

conga-SMX8-Plus

• NXP i.MX 8M Plus application processor
• Integrated Neural Processing Unit (NPU)
• Quadcore Arm® Cortex®-A53 / M7
• Up to 3 independent display outputs
• Industrial temperature support

conga-SMX8-Plus embedded AI Vision Kit

congatec i.MX 8M Plus Vision Kit for AI and Machine Learning applications

conga-SMX8X

• NXP MX8-X application processor
• Ultra-low power design (2-5 W)
• Up to quadcore Arm® Cortex®-A35
• 1x Arm® Cortex®-M4F for real-time processing
• Industrial temperature support

conga-STDA4

• TI processor TDA4VM or DRA829J
• Dual Arm® Cortex®-A72
• Deep learning hardware accelerator
• Arm® Cortex®-R5F MCUs for real-time communication
• Industrial temperature support

conga-TC170

• 6th Generation Intel® Core™ and Celeron®
• Size-optimized design
• Low power consumption (TDP 15 W)
• Up to 2 cores
• Up to 32 GB DDR4 memory

conga-TC175

• 7th Generation Intel® Core™ and Celeron®
• Size-optimized design
• Low configurable power consumption (cTDP 7.5 W)
• Up to 2 cores
• Up to 32 GB DDR4 memory

conga-TC370

• 8th Generation Intel® Core™ and Celeron®
• Size- and power-optimized design
• Up to 4 cores
• Supports USB 3.1 Gen 2 (10 Gbit/sw)
• Up to 64 GB memory

conga-TC570

• 11th Generation Intel® Core™
• Compact design
• Up to 4 cores
• Extended temperature range options
• PCIe Gen 4

conga-TC570r

• 11th Generation Intel® Core™
• Extremely rugged with soldered memory
• Extended temperature range options
• IEC-60068 certified
• PCIe Gen 4

conga-TC675

• 13th Generation Intel® Core™
• Intel® Performance Hybrid Architecture
• Extended temperature range options
• Up to 14 cores
• PCIe Gen 4

conga-TCA5

• Intel Atom® x7-E, Intel® Pentium® and Celeron®
• Size-optimized design
• Low power consumption (12 W)
• Up to 4 cores
• Extended temperature range options

conga-TCA7

• Intel Atom® x6000E, Intel® Pentium® and Celeron®
• Cost- and power-optimized design
• Up to 4 cores
• Extended temperature range options
• Supports TSN and TCC

conga-TCV2

• AMD Embedded Ryzen V2000 processor series
• High-performance Vega 7 GPU
• Superior cost/performance ratio
• Up to 8 cores
• Wide TDP range from 10-54 W

conga-TR4

• AMD Embedded Ryzen V1000 processor series
• High-performance Vega GPU
• Supports up to 4x 4k
• Up to 4 cores
• Wide TDP range down to 12 W

conga-TS170

• 6th Generation Intel® Core™ and Xeon®
• Performance-optimized design
• Up to 4 cores
• Up to 32 GB DDR4
• ECC support for Intel® Xeon®

conga-TS175

• 7th Generation Intel® Core™ and Xeon®
• Performance-optimized design
• Up to 4 cores
• Up to 32 GB DDR4
• ECC support

conga-TS370

• 8th Generation Intel® Core™ and Xeon®
• Performance-optimized design
• Up to 6 cores
• Supports USB 3.1 Gen 2 (10 Gbit/sw)
• Up to 64 GB ECC memory

conga-TS570

• 11th Generation Intel® Core™
• Performance-optimized design
• Up to 8 cores
• Extended temperature range options
• PCIe Gen 4

conga-MEVAL

• Evaluation carrier board for COM Express Type 10
• 2x PCIe card slots for 5 lanes
• Schematics available on project basis