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conga-BS77 (EOL)
COM Express™ Basic Type 2 모듈 3세대 Intel® Core™ 프로세서
- 최고성능 COM Express Basic Type 2 모듈
- 3세대Intel® Core™ 기반 플랫폼
- HD 그래픽, HD 화상 회의를 위한 원활한 트랜스 코드 지원
- 향상된 그래픽 성능, DirectX®11
Specification
Intel® Flexible Display Interface (FDI), Intel® Dynamic Video Memory Technology (Intel® DVMT) OpenGL 3.1 and DirectX11 support. Three independent pipelines provide support for three independent displays (must be 2 DisplayPort plus any other display).
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Manual
Application Note
Data Sheet
Software
Product Variants
Ecosystem Details
Cooling solutions
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Accessories
conga-CKIT (EOL)
이 제품은 모든 COM Express™ Type 2 모듈을 즉시 평가할 수 있는 개발 키트입니다.
conga-CEVAL (EOL)
COM Express® Type 2 모듈을 지원하는 Evaluation Carrier 보드
conga-Cdebug (EOL)
COM Express® Type 2 모듈과 Carrier 보드 디버깅 플랫폼
conga-FPA2 (EOL)
Universal Flat Panel 어댑터 보드
conga-LDVI
LVDS 출력을 위한 DVI 컨버터 모듈