conga-BS77 (EOL)
Módulo COM Express™ Básico, Tipo 2, basado en la familia de procesadores Intel® Core™ de tercera generación
- COM Express, Tipo 2, de óptimo rendimiento
- Plataforma basada en procesadores Intel® Core™ de tercera generación
- Mejor transcodificación HD-HD, videoconferencia en HD
- Rendimiento gráfico mejorado, DirectX®11
Specification
Intel® Flexible Display Interface (FDI), Intel® Dynamic Video Memory Technology (Intel®DVMT) OpenGL 3.1 and DirectX11 support. Three independent pipelines provide support for three independent displays (must be 2 DisplayPort plus any other display).
It is capable of calculating efficient hashand RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°CStorage: -20 to +80°C
Documents
Application Note
Data Sheet
Software
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Product Variants
Ecosystem Details
Cooling solutions
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Accessories
conga-CKIT (EOL)
Este kit completo permite iniciar inmediatamente la evaluación de los módulos COM Express™ Tipo 2.
conga-CEVAL
Placa base de evaluación para módulos COM Express®, con definición de patillaje tipo 2
conga-Cdebug
Plataforma de depuración COM Express® para módulos tipo 2 y placas base
conga-FPA2 (EOL)
Placa adaptadora universal para pantallas planas
conga-LDVI
Módulo convertidor a DVI para LVDS