conga-BS77 (EOL)
Modulo COM Express™ Basic di tipo 2 basato sulla famiglia di processori Intel® Core™ di terza generazione
- Modulo COM Express di tipo 2 ad altissime prestazioni
- Piattaforma basata su processore Intel® Core™ di terza generazione
- Migliore transcodifica HD-HD, video-conferenze in HD
- Capacità grafica migliorata, DirectX®11
Specification
Intel® Flexible Display Interface (FDI), Intel® Dynamic Video Memory Technology (Intel®DVMT) OpenGL 3.1 and DirectX11 support. Three independent pipelines provide support for three independent displays (must be 2 DisplayPort plus any other display).
It is capable of calculating efficient hashand RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°CStorage: -20 to +80°C
Documents
Application Note
Data Sheet
Software
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Product Variants
Ecosystem Details
Cooling solutions
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Accessories
conga-CKIT (EOL)
Questo kit completo offre la possibilità di iniziare a valutare immediatamente i moduli Express ™COM di tipo 2
conga-CEVAL
Scheda carrier di Valutazione per Moduli COM Express®basata su definizione pinout Type 2
conga-Cdebug
Piattaforma COM Express® Debug per Muduli Type 2 e Schede Carrier
conga-FPA2 (EOL)
Scheda per Adattatore Universale flat Panel
conga-LDVI
Covertitore di moduli DVI perLVDS