conga-bID7 Preview image
  • conga-bID7 Image 1
  • conga-bID7 Image 2

Your item has been added to the inquiry

conga-bID7 Image

conga-bID7

COM Express® basic Type 7 with Intel® Xeon® D-1700 / D-1800 processor family

Selected module variant

    Selected ecosystem parts

    Cooling Solutions

      Carrierboards

        Value adding ecosystem offerings


        Cooling Solutions

        Carrierboards

        見積りを依頼 + Add more articles

        conga-bID7

        formerly JUMPtec COMe-bID7
        COM Express® basic Type 7 with Intel® Xeon® D-1700 / D-1800 processor family
         
        Learn all about COMs - download the guide
        • Scalable 4-10 core module for robust, space-limited industrial use (-40 °C to +85 °C).
        • Up to 128 GB RAM via 4 × SO-DIMM and optional 1 TB onboard NVMe SSD.
        • 16 × PCIe Gen4 + 16 × PCIe Gen3 for high data throughput.
        • 4 × 10GBASE-KR interfaces enable flexible backplane, copper, or fiber connectivity.
        Congatec Logo
        Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

        Value adding ecosystem offerings

        Cooling Solutions

        Carrierboards

        Specification

        Formfactor
        COM Express Basic
        CPU
        Intel® Xeon® D-1749NT (10 x 3.50 GHz, 15 MB Cache, 90 W)
        Intel® Xeon® D-1712TR (4 x 2.0 GHz, 10 MB cache, 50G Eth, 39W)
        Intel® Xeon® D-1735TR (8 x 2.2 GHz, 15 MB cache, 50G Eth, 59W)
        Intel® Xeon® D-1715TER (4 x 2.4 GHz, 10 MB cache, 50G Eth, 50W)
        Intel® Xeon® D-1732TE (8 x 1.9 GHz, 15 MB cache, 50G Eth, 52W)
        Intel® Xeon® D-1747NTE (10 x 2.0 GHz, 15 MB cache, 100G Eth, 80W)
        Intel® Xeon® D-1746TER (10 x 2.0 GHz, 15 MB cache, 100G Eth, 67W)
        DRAM
        2x DDR5 SO-DIMM with up to 32 GByte per channel (non-ECC)
        Ethernet
        1x 1/2.5 Gb (1/2.5 GBASE-T)
        4x 10GbE (10 GBASE-KR) according COM.0 R3.1
        I/O Interfaces
        2 x serial interface (RX/TX only)
        4 x USB 3.0 / USB 2.0
        16x PCIe Gen4 (1 x16, 2 x8, 4 x4) according COM.0 R3.1
        16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
        SPI
        LPC
        SM-Bus
        RTC
        16x PCIe Gen4 (1 x16, 2 x8, 4 x4) according COM.0 R3.1
        16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
        Mass storage
        4x SATA 6Gb/s
        embedded BIOS Features
        AMI UEFI
        Security
        Trusted Platform Module (TPM 2.0)
        Power Management
        ACPI 6.0
        Operating Systems
        Linux
        Windows®10
        Microsoft® Windows 11
        Windows Server 2022
        Temperature
        Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
        Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
        Humidity
        93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
        Features
        Staged Watchdog
        Size
        95 x 125 mm (3.74" x 4.92")

        Documents

        All documents found on this page are updated without notification. Always check this page for the latest version.

        Data Sheet

        Data Sheet for conga-bID7
        15.12.2025

        Whitepaper

        The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

        Product Variants

        Product Filter:

          Add Filter:

           - 
           - 
           - 
           - 
           - 
           - 
              There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
              If you don't find the configuration you require contact your congatec Sales representative for further assistance.
              conga-bID7/D-1747NTE (P/N 68009-0000-47-2)
              conga-bID7/D-1746TER (P/N 68009-0000-46-1)
              conga-bID7/D-1732TE (P/N 68009-0000-32-1)
              conga-bID7/D-1715TER (P/N 68009-0000-15-1)
              conga-bID7/D-1749NT (P/N 68008-0000-49-2)
              conga-bID7/D-1735TR (P/N 68008-0000-35-1)
              conga-bID7/D-1712TR (P/N 68008-0000-12-1)

              Ecosystem Details

              Cooling Solutions

              HSP COME-BID7 (E2) THREAD (P/N 68009-0000-99-0)

              Heatspreader for COMe-bID7 commercial and E2, threaded mounting holes

              HSP COME-BDV7 (E2) THROUGH (P/N 68009-0000-99-1)

              Heatspreader for COMe-bID7 commercial and E2, through holes

              HSK COMe-BASIC ACTIVE (W/O HSP) (P/N 38025-0000-99-0C05)

              Active Cooler for COMe-bxL6/bDV7 to be mounted on HSP

              HSK COMe-BASIC PASSIVE (W/O HSP) (P/N 38025-0000-99-0C06)

              Passive Cooler for COMe-bxL6/bDV7 to be mounted on HSP

              Carrierboards

              ADA-COME-T7-G2 4X10G RJ45 - DEV-TOOL (P/N 68301-0000-01-4)

              Adapter Card with 4x RJ45 ports for use with COM Express® Eval Carrier Type 7 G2 – X557 PHY

              ADA-COME-T7-G2 4X10G DAC - DEV-TOOL (P/N 68301-0000-04-4)

              Adapter Card with 4x 10G-KR ports for use with COM Express® Eval Carrier Type 7 G2 – no PHY

              ADA-COME-T7-G2 4X10G SFP+ - C827-IM1 (P/N 68301-0000-05-4)

              Adapter Card with 4x SFP+ ports for use with COM Express® Eval Carrier Type 7 G2 – C827-IM1 PHY

              COM Express® Eval Carrier2 T7 (P/N 68301-0001-00-8)

              COMe Eval Carrier T7 G2-8, 8 mm stack height, COM.0 R3.1, support of PCIe Gen4

              製品比較