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conga-bID7

COM Express® basic Type 7 with Intel® Xeon® D-1700 / D-1800 processor family

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    Cooling Solutions

      Carrierboards

        Zusätzliche Ecosystem Parts


        Cooling Solutions

        Carrierboards

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        conga-bID7

        formerly JUMPtec COMe-bID7
        COM Express® basic Type 7 with Intel® Xeon® D-1700 / D-1800 processor family
         
        Learn all about COMs - download the guide
        • Intel® Xeon® D-1700 / D-1800 processor family
        • Scalable 4-10 core module for robust, space-limited industrial use (-40 °C to +85 °C).
        • Up to 128 GB RAM via 4 × SO-DIMM and optional 1 TB onboard NVMe SSD.
        • 16 × PCIe Gen4 + 16 × PCIe Gen3 for high data throughput.
        • 4 × 10GBASE-KR interfaces enable flexible backplane, copper, or fiber connectivity.
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        Zusätzliche Ecosystem Parts

        Cooling Solutions

        Carrierboards

        Spezifikation

        Formfactor
        COM Express Basic
        CPU
        Intel® Xeon® D-1749NT (10 x 3.50 GHz, 15 MB Cache, 90 W)
        Intel® Xeon® D-1712TR (4 x 2.0 GHz, 10 MB cache, 50G Eth, 39W)
        Intel® Xeon® D-1735TR (8 x 2.2 GHz, 15 MB cache, 50G Eth, 59W)
        Intel® Xeon® D-1715TER (4 x 2.4 GHz, 10 MB cache, 50G Eth, 50W)
        Intel® Xeon® D-1732TE (8 x 1.9 GHz, 15 MB cache, 50G Eth, 52W)
        Intel® Xeon® D-1747NTE (10 x 2.0 GHz, 15 MB cache, 100G Eth, 80W)
        Intel® Xeon® D-1746TER (10 x 2.0 GHz, 15 MB cache, 100G Eth, 67W)
        DRAM
        2x DDR5 SO-DIMM with up to 32 GByte per channel (non-ECC)
        Ethernet
        1x 1/2.5 Gb (1/2.5 GBASE-T)
        4x 10GbE (10 GBASE-KR) according COM.0 R3.1
        I/O Interfaces
        2 x serial interface (RX/TX only)
        4 x USB 3.0 / USB 2.0
        16x PCIe Gen4 (1 x16, 2 x8, 4 x4) according COM.0 R3.1
        16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
        SPI
        LPC
        SM-Bus
        RTC
        16x PCIe Gen4 (1 x16, 2 x8, 4 x4) according COM.0 R3.1
        16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
        Mass storage
        4x SATA 6Gb/s
        embedded BIOS Features
        AMI UEFI
        Security
        Trusted Platform Module (TPM 2.0)
        Power Management
        ACPI 6.0
        Operating Systems
        Linux
        Windows®10
        Microsoft® Windows 11
        Windows Server 2022
        Temperature
        Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
        Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
        Humidity
        93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
        Features
        Staged Watchdog
        Size
        95 x 125 mm (3.74" x 4.92")

        Dokumente

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        Data Sheet

        Data Sheet for conga-bID7
        15.12.2025

        Whitepaper

        The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

        Produktvarianten

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              conga-bID7/D-1747NTE (P/N 68009-0000-47-2)
              conga-bID7/D-1746TER (P/N 68009-0000-46-1)
              conga-bID7/D-1732TE (P/N 68009-0000-32-1)
              conga-bID7/D-1715TER (P/N 68009-0000-15-1)
              conga-bID7/D-1749NT (P/N 68008-0000-49-2)
              conga-bID7/D-1735TR (P/N 68008-0000-35-1)
              conga-bID7/D-1712TR (P/N 68008-0000-12-1)

              Ecosystem Details

              Cooling Solutions

              HSP COME-BID7 (E2) THREAD (P/N 68009-0000-99-0)

              Heatspreader for COMe-bID7 commercial and E2, threaded mounting holes

              HSP COME-BDV7 (E2) THROUGH (P/N 68009-0000-99-1)

              Heatspreader for COMe-bID7 commercial and E2, through holes

              HSK COMe-BASIC ACTIVE (W/O HSP) (P/N 38025-0000-99-0C05)

              Active Cooler for COMe-bxL6/bDV7 to be mounted on HSP

              HSK COMe-BASIC PASSIVE (W/O HSP) (P/N 38025-0000-99-0C06)

              Passive Cooler for COMe-bxL6/bDV7 to be mounted on HSP

              Carrierboards

              ADA-COME-T7-G2 4X10G RJ45 - DEV-TOOL (P/N 68301-0000-01-4)

              Adapter Card with 4x RJ45 ports for use with COM Express® Eval Carrier Type 7 G2 – X557 PHY

              ADA-COME-T7-G2 4X10G DAC - DEV-TOOL (P/N 68301-0000-04-4)

              Adapter Card with 4x 10G-KR ports for use with COM Express® Eval Carrier Type 7 G2 – no PHY

              ADA-COME-T7-G2 4X10G SFP+ - C827-IM1 (P/N 68301-0000-05-4)

              Adapter Card with 4x SFP+ ports for use with COM Express® Eval Carrier Type 7 G2 – C827-IM1 PHY

              COM Express® Eval Carrier2 T7 (P/N 68301-0001-00-8)

              COMe Eval Carrier T7 G2-8, 8 mm stack height, COM.0 R3.1, support of PCIe Gen4

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