COM Express Basic Type 6 module | AMD Embedded RX-421BD SOC | AMD Radeon™ R7 Graphics | TDP 15/12-35W | Quad-core | CPU freq. 2.1/3.4 GHz | 8 GPU-CU | GPU freq. 800 MHz
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conga-TR3 (EOL)
COM Express® Type6 module based on AMD Embedded R-Series SOC processor-based platform
- Up to 4 “Excavator” Cores
- High performance integrated 3rd Gen. GCN graphics with up to 512 stream processors
- ECC protected DDR4 memory up to 32 GByte
Specification
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Documents
Data Sheet
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
COM Express Basic Type 6 module | AMD Embedded RX-418GD SOC | AMD Radeon™ R6 Graphics | TDP 15/12-35W | Quad-core | CPU freq. 1.8/3.2 GHz | 6 GPU-CU | GPU freq. 800 MHz
COM Express Basic Type 6 module | AMD Embedded RX-216GD SOC | AMD Radeon™ R5 Graphics | TDP 15/12-15W | Dual-core | CPU freq. 1.6/3.0 GHz | 4 GPU-CU | GPU freq. 800 MHz
COM Express Type 6 Basic module with AMD embedded G-Series GX-217GI (Brown Falcon) dual core processor with 1.7GHz up to 2.0GHz core frequency, 1MB L2 cache and 1600MT/s DDR4L SOIMM memory interface for up to 32GB. Features AMD Radeon™ 3rd Generation Graphics Core Next.
Ecosystem Details
Cooling solutions
Standard heatspreader for high performance COM Express module conga-TR3 with integrated heat pipes. All standoffs are with 2.7mm bore hole
Standard heatspreader for high performance COM Express module conga-TR3 with integrated heat pipes. All standoffs are M2.5mm thread.
Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread
Memory
260pin DDR4 SODIMM memory module with 2400 MT/s (PC4-2400) and 4GB RAM for conga-TR3. CL17 or better. Supply voltage VDD=1,2V.1024M x8 Dual Rank only.
DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
260pin DDR4 SODIMM memory module with 2400 MT/s (PC4-2400) and 16GB RAM for conga-TR3. CL17 or better. Supply voltage VDD=1,2V.1024M x8 Dual Rank only.
DDR4 ECC SODIMM memory module with 2400 MT/s and 4GB RAM for conga-TR3
DDR4 ECC SODIMM memory module with 2400 MT/s and 8GB RAM for conga-TR3
DDR4 ECC SODIMM memory module with 2400 MT/s and 16GB RAM for conga-TR3
Industrial DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
Industrial DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
Industrial DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM
Industrial DDR4 ECC SODIMM memory module with 2400 MT/s and 4GB RAM
Industrial DDR4 ECC SODIMM memory module with 2400 MT/s and 8GB RAM
Industrial DDR4 ECC SODIMM memory module with 2400 MT/s and 16GB RAM
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Accessories
conga-TEVAL/COMe 3.0
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0
conga-LDVI
LVDSからDVIへ変更モジュール
conga-LDVI
DVI Converter Module for LVDS
conga-TEVAL/COMe 3.0
COM Express Type 6 Rev. 3.0 モジュール用 評価キャリアボード