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conga-MC1000

COM Express® Mini Type 10 モジュール（第3世代 Intel® Core™ Ultra プロセッサー・シリーズ（Panther Lake）ベース）

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              conga-MC1000

              インテル® Core™ Ultra プロセッサー Series 3（Panther Lake-H）搭載 COM Express® Mini モジュール

              COMについて学ぶ  - download the guide

              • 最大16コアのインテル® パフォーマンス ハイブリッド アーキテクチャー
              • 最大12 Xᵉコアのインテル® Arc™グラフィックス
              • 最大50 TOPSの内蔵NPUと最大180 TOPSのトータル プラットフォーム パフォーマンス
              • 最大限のメモリー帯域幅を実現するために最大32 GBのLPDDR5xメモリーを直付け実装
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              Value adding ecosystem offerings

              Virtualization

              Operating Systems

              IOT Software

              Cooling Solutions

              Module services

              Specification

              Formfactor
              COM Express Mini
              CPU
              Intel® Core™ Ultra X7 358H – 16 x 4.8 GHz, 18MB cache, 25W
              Intel® Core™ Ultra 5 325 – 8 x 4.5 GHz, 12MB cache, 25W
              Intel® Core™ Ultra 5 336HRE – 12, 18MB cache, 25W
              Intel® Core™ Ultra 5 335RE – 8, 12MB cache, 25W
              Intel® Core™ Ultra 7 356H – 16 x 4.7 GHz, 18MB cache, 25W
              Intel® Core™ Ultra 7 366HRE – 16, 18MB cache, 25W
              Intel® Core™ Ultra 7 365RE – 8, 12MB cache, 25W
              DRAM
              Up to 32GB LPDDR5x soldered down with up 8533 MT/s | In-band ECC (only on selected product variants)
              Ethernet
              2.5 GbE via Intel® i226 Ethernet controller series | supporting TSN (only on selected product variants)
              I/O Interfaces
              4 x PCIe
              2 x USB 3.2
              8 x USB 2.0
              2 x SATA
              2 x UART (RX/TX only)
              GPIO
              GSPI
              LPC
              SM-Bus
              I²C
              Mass storage
              NVMe up to 1 TB capacity SSD
              Graphics
              Intel® Arc Graphics with up to 12 Xe cores or Intel Graphics with up to 4 Xe cores | Intel® Xe Matrix Extensions
              NPU/AI Acceleration
              Integrated NPU accelerator 50 TOPS | Up to 180 TOPS platform total
              congatec Board Controller
              Module Management Controller | Multistage Watchdog | Board Information | Board Statistics | I²C bus (fast mode) | Power Loss Control | Hardware Health Monitoring | POST Code Redirection
              embedded BIOS Features
              AMI Aptio® UEFI firmware
              OEM Logo
              OEM CMOS Defaults
              LCD Control
              Display Auto Detection
              Backlight Control
              Security
              Trusted Platform Module (TPM 2.0)
              Power Management
              ACPI 6.0 | wide range power supply 8.5V – 20V | single supply power
              Operating Systems
              Microsoft® Windows 11 IoT Enterprise
              Microsoft® Windows 11
              Linux
              Hypervisor
              conga-zones Hypervisor
              Temperature
              Commercial variants: Operation: 0° to +60°C | Storage: -20° to +80°C
              Industrial variants: Operation: -40° to +85°C | Storage: -40° to +85°C
              Humidity
              Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
              Video Interfaces
              1 x DDI for DP++
              1 x single-channel LVDS or optional eDP
              2 x independent displays up to 4k
              Features
              Staged Watchdog
              Size
              55 x 84 mm (2.17" x 3.31")

              Documents

              All documents found on this page are updated without notification. Always check this page for the latest version.

              Data Sheet
              Data Sheet for conga-MC1000 28.10.2026
              Whitepaper
              The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.
              COMs with Intel Core Ultra Series 3 Download for free and discover how modular embedded AI platforms powered by Intel® Core™ Ultra Series 3 deliver high-performance local AI – without extra accelerator hardware.
              AI for Medical Imaging Platforms Download for free and discover how Intel® Core™ Ultra Series 3 processors power compact AI-enabled ultrasound systems – enabling real-time imaging and AI-assisted workflows without discrete accelerators.

              Product Variants

              partnumber(s) found

              conga-MC1000/ultra7-356H-16G (P/N 049903)

              COM Express Mini module based on Intel® Core Ultra 7 356H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | LPDDR5x memory module with up to 8533 MT/s and 16 GB system memory capacity | commercial grade temperature range from 0°C to 60°C.

              conga-MC1000/ultra5-325-16G (P/N 049906)

              COM Express Mini module based on Intel® Core Ultra 5 325 processor with 4 P-cores and 4 LPE-cores | Integrated NPU | 12MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | LPDDR5x memory module with up to 8533 MT/s and 16 GB system memory capacity | commercial grade temperature range from 0°C to 60°C.

              conga-MC1000/ultraX7-358H-16G (P/N 049907)

              COM Express Mini module based on Intel® Core Ultra X7 358H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 12Xe cores | LPDDR5x memory module with up to 8533 MT/s and 16 GB system memory capacity | commercial grade temperature range from 0°C to 60°C.

              conga-MC1000/ultra7-366HRE-32G (P/N 049910)

              COM Express Mini module based on Intel® Core Ultra 7 366H processor with 4 P-cores, 8 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | 32 GB LPDDR5x onboard memory with up to 8533 MT/s |industrial grade temperature range from -40°C to 85°C.

              conga-MC1000/ultra7-365RE-16G (P/N 049911)

              COM Express Mini module based on Intel® Core Ultra 7 365RE processor with 4 P-cores and 4 LPE-cores | Integrated NPU | 12MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | 16 GB LPDDR5x onboard memory with up to 6800 MT/s | industrial grade temperature range from -40°C to 85°C.

              conga-MC1000/ultra5-336HRE-16G (P/N 049912)

              COM Express Mini module based on Intel® Core Ultra 5 336HRE processor with 4 P-cores, 4 E-cores and 4 LPE-cores | Integrated NPU | 18MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | 16 GB LPDDR5x onboard memory with up to 8533 MT/s |industrial grade temperature range from -40°C to 85°C.

              conga-MC1000/ultra5-335RE-16G (P/N 049913)

              COM Express Mini module based on Intel® Core Ultra 5 335RE processor with 4 P-cores and 4 LPE-cores | Integrated NPU | 12MB Intel® Smart Cache LLC | Intel Graphics with 4Xe cores | 16 GB LPDDR5x onboard memory with up to 8533 MT/s | industrial grade temperature range from -40°C to 85°C.

              Ecosystem Details

              Virtualization

              conga-zones Hypervisor (P/N 300501)

              Operating Systems

              ctrlX OS (P/N 300020 )
              Ubuntu Pro (P/N N/A)

              IOT Software

              Application Manager (P/N 300201)
              COM Manager (P/N 300200)
              Fleet Manager (P/N 300202)
              Cloud Connector (P/N 300203)

              Cooling Solutions

              conga-MC1000/HSP-B (H484) (P/N 049954)

              Standard heatspreader for high performance COM Express module conga-MC1000 with H484. All standoffs are with 2.7mm bore hole.

              conga-MC1000/HSP-B (H404) (P/N 049957)

              Standard heatspreader for high performance COM Express module conga-MC1000 with H404. All standoffs are M2.5mm threaded.

              conga-MC1000/HSP-B (H404) (P/N 049956)

              Standard heatspreader for high performance COM Express module conga-MC1000 with H404. All standoffs are with 2.7mm bore hole.

              conga-MC1000/HSP-T (H484) (P/N 049955)

              Standard heatspreader for high performance COM Express module conga-MC1000 with H484. All standoffs are M2.5mm threaded.

              Module services

              Design-In Training (P/N 27000001)

              Design-Training to develop carrier boards for Computer on Modules

              What is aReady.COM?

              aReady.COM is congatec’s pre-validated and pre-configured platform that combines modular hardware and software building blocks to accelerate embedded development. It includes Computer-on-Modules, virtualization by Hypervisor, and pre-installed, licensed OS like ctrlX OS or Ubuntu Pro. Whether for edge computing or IIoT, aReady.COM simplifies integration, enhances security, and shortens time to market.


              Learn more