Press Releases

New COM-HPC Mini module from congatec with Qualcomm Dragonwing™ IQ-X processors opens up new applications

I moduli COM (Computer-on-Module) di congatec basati sui nuovi processori Dragonwind™ di Qualcomm accelerano la diffusione di applicazioni edge AI robuste ad alte prestazioni

congatec presents its expanded portfolio and aReady.COM platforms

Company drives attendance with free exhibit hall pass, $50 value

conga-TC675r completes IEC 60068 testing, offering a compact, application-ready embedded module for extreme environments

congatec and Aaronn Electronic join forces to deliver greater product diversity, faster development times, and personalized support in the DACH region

New VDC Research white paper with congatec and NXP: Standardized COMs with i.MX 95 processors drive industrial vision AI adoption amidst 48.3% edge AI growth

congatec to showcase application-ready embedded solution platforms at CIIF 2025 in Shanghai

congatec GmbH acquisisce la maggioranza di JUMPtec GmbH, rafforzando la leadership tecnologica e ampliando l'offerta nel settore dei moduli COM

New local manufacturing capacities strengthen congatec's global presence and address international trade disruptions

High-performance ecosystems for innovative solutions

Moduli COM resistenti al freddo estremo

Atlanta, Georgia e Deggendorf, Germania, 11 marzo, 2025 * * *AMI®, azienda di riferimento a livello globale nello sviluppo di firmware dinamico per i sistemi di elaborazione e congatec, azienda…

Moduli COM con prestazioni AI eccezionali grazie ai processori Intel Core Ultra

Empowering smart factories: congatec highlights application-ready solution platforms