Simplifying the use of embedded technology – congatec @ Teknologia 2025, Booth 6f31

4. - 6. November 2025 | Booth 6f31

congatec will be at Teknologia 2025, where industry, technology, and the future meet, at the Helsinki Expo and Convention Centre in Finland.

Visit us at Booth 6f31 on November 4th to 6th to see how we continue to evolve our application-ready COM-HPC, COM Express, and SMARC ecosystems to make high-performance embedded computing accessible and easy to integrate, while providing a foundation for scalable, energy-efficient, and secure designs. And if you’re feeling lucky, spin our wheel of fortune and stand a chance to win one of 10 Bluetooth speakers! Here are just some examples of what you can expect at Booth 6f31 at the Helsinki Expo and Convention Centre:

 

Register Here




Here’s what you can be looking forward to:

High-performance COM-HPC modules

Let us inspire you with our complete ecosystem of COM-HPC modules, including the new COM-HPC Mini form factor, cooling solutions, and carrier boards.

Find out more here

Our SMARC ecosystem

Maximize the efficiency, flexibility, and scalability of your embedded systems with our SMARC modules, which enable low-power, compact designs.

Learn more

 

Passive cooling solutions

Discover fanless cooling solutions for robust, high-performance edge servers in challenging environments.
 

Learn more

 

 





Let's stay in touch

We’re happy to support you. Whether it’s a quick question, detailed feedback, or a product request – feel free to reach out.

Compare products