Simplifying the use of embedded technology – congatec @ Teknologia 2025, Booth 6f31
4. - 6. November 2025 | Booth 6f31
congatec will be at Teknologia 2025, where industry, technology, and the future meet, at the Helsinki Expo and Convention Centre in Finland.
Visit us at Booth 6f31 on November 4th to 6th to see how we continue to evolve our application-ready COM-HPC, COM Express, and SMARC ecosystems to make high-performance embedded computing accessible and easy to integrate, while providing a foundation for scalable, energy-efficient, and secure designs. And if you’re feeling lucky, spin our wheel of fortune and stand a chance to win one of 10 Bluetooth speakers! Here are just some examples of what you can expect at Booth 6f31 at the Helsinki Expo and Convention Centre:
Here’s what you can be looking forward to:
High-performance COM-HPC modules
Let us inspire you with our complete ecosystem of COM-HPC modules, including the new COM-HPC Mini form factor, cooling solutions, and carrier boards.
Our SMARC ecosystem
Maximize the efficiency, flexibility, and scalability of your embedded systems with our SMARC modules, which enable low-power, compact designs.
Passive cooling solutions
Discover fanless cooling solutions for robust, high-performance edge servers in challenging environments.
