Let’s meet at Teknologia 2023!
7. - 9. November 2023 | Booth 6d30
At our booth, you’ll experience our exciting range of latest Computer-on-Module ecosystem offerings from low-power to high-performance for the core of the industrial transformation.
Here’s what you can be looking forward to:
compact COM with certified ruggedness
See our IEC-60068 certified COM Express compact module. With soldered processor and RAM it offers extreme ruggedness so your applications can reliably operate even when exposed to extreme temperatures, rapid temperature changes, shocks, and vibrations.
More performance for rugged edge servers
Check out our rugged edge server reference system designs powered by high-performance COM-HPC modules with heat pipe cooling. Ideal for harsh industrial environments, they enable workload consolidation and orchestrating communications in IoT networks.
Low-power platforms for the industrial transformation
To make the industrial transformation a success applications have to feature high-performance in a low-power envelop supporting robust real-time operation, real-time connectivity, and real-time hypervisor technologies for system consolidation. Our rugged modules offer exactly this.
These are just a few select booth highlights. But we have a lot more for you to explore.
Arrange a meeting with Timo Poikonen today to discuss all the ways we can accelerate your applications at our Booth 6d300 during Teknologia 2023.
Your congatec team.
Stay up to date!
Subscribe to our newsletter to receive up to date information on new products, trends, events, webinars and whitepapers.
