congatec expands its highly skilled engineering team, establishing congatec Asia Embedded Design Sdn. Bhd. in Penang, Malaysia
congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series
Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms
Large éventail de modules congatec pour applications IA embarquées de calcul puissantes et efficaces énergiquement
KontronOS, the secure, hardened Linux®-based Operating System, expands congatec’s standards-based and cybersecure aReady.COM offering
Nouveau module COM-HPC Mini de congatec équipe de processeurs Qualcomm Dragonwing IQ-X ouvrant la voie à de nouvelles applications
Les Computer-on-Modules embarqués de congatec accélèrent l’IA de périphérie haute performances avec les processeurs Qualcomm Dragonwing
congatec presents its expanded portfolio and aReady.COM platforms
Company drives attendance with free exhibit hall pass, $50 value
conga-TC675r passe les tests IEC 60068, offrant un module embarqué compact et prêt à l’emploi pour environnements extrêmes
congatec and Aaronn Electronic join forces to deliver greater product diversity, faster development times, and personalized support in the DACH region
New VDC Research white paper with congatec and NXP: Standardized COMs with i.MX 95 processors drive industrial vision AI adoption amidst 48.3% edge AI growth
congatec to showcase application-ready embedded solution platforms at CIIF 2025 in Shanghai
congatec GmbH acquiert la majorité de JUMPtec GmbH, renforce son leadership technologique et sa gamme de Computer-on-Modules
New local manufacturing capacities strengthen congatec's global presence and address international trade disruptions
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