Your item has been added to the inquiry
conga-TS77 (EOL)
Módulo COM Express® Básico, Tipo 6, basado en plataforma de procesadores Intel® Core™ de tercera generación
- COM Express, Tipo 6, de óptimo rendimiento
- Plataforma basada en procesadores Intel® Core™ de tercera generación
- Mejor transcodificación HD-HD, videoconferencia en HD
- Rendimiento gráfico mejorado, DirectX®11
Specification
MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 MBit/s, hardware motion compensation
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Image
Application Note
Data Sheet
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
Ecosystem Details
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Cooling solutions
Standard active cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes | 15mm silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
Standard active cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes | 15mm silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread
Standard passive cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes
15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole
Standard passive cooling solution for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes
15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread
Standard heatspreader for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes. All standoffs are with 2.7mm bore hole
Standard heatspreader for high performance COM Express modules conga-TS67 and TS77 with integrated heat pipes. All standoffs are M2.5mm thread
Accessories
conga-FPA2 (EOL)
Placa adaptadora universal para pantallas planas
conga-LDVI
Módulo convertidor a DVI para LVDS
conga-TEVAL/COMe 2.1 (EOL)
Placa base de evaluación para módulos COM Express® Tipo 6