congatec extends its global manufacturing capacity with Kontron cooperation

New local manufacturing capacities strengthen congatec's global presence and address international trade disruptions

Dr. Dominik Ressing, CEO of congatec, and Konrad Garhammer, COO and CTO of congatec, are excited about the extended cooperation with Kontron.

Deggendorf, Germany, 15 May, 2025 * * * congatec – a leading vendor of embedded and edge computing technology – announced today it is extending its cooperation with Kontron – a leading global supplier of IoT technology – to add Kontron to congatec's existing partners for manufacturing Computer-on-Modules. This cooperation is an important element of congatec’s local for local approach to increase efficiency in the light of international trade disruptions and growing customer demand driven by geopolitical considerations.

congatec gains access to Kontron's broad international production network of over 20 plants in different configurations, leveraging Kontron's expertise in SMT assembly. By making use of Kontron’s local production facilities in the United States, congatec expects significant cost advantages and avoidance of tariffs into the USA. Furthermore, congatec will utilize Kontron’s supply chain management, production, and logistics capabilities to further enhance its global reach and local presence in all regions of the world.

“The manufacturing cooperation with Kontron is a natural move, as both companies share the same values and innovative technology roadmap with powerful partnerships with leading silicon vendors including Intel, AMD, Qualcomm, Texas Instruments, and NXP,” explains Konrad Garhammer, COO and CTO of congatec. “Based on our broad Computer-on-Modules portfolios, we both serve the highest customer requirements in demanding industries, including medical, industrial automation, robotics and embedded edge computing for transportation, avionics and in-vehicle.”

Cooperation expected to expand in the near future
“With Kontron subsidiary JUMPtec and congatec both being leading developers of embedded modules for the standards COM Express, COM-HPC, SMARC Module, and Qseven, we are planning to extend our cooperation to other areas in the near future,” adds Dr. Dominik Ressing, CEO of congatec. “Currently we are discussing potential partnerships for development, know-how exchange, and joint sales and marketing activities that could, subject to reaching an agreement, also lead to a capital investment of congatec in JUMPtec.”