2019 CIIF-China International Industry Fair

From Sept. 17th to 21st, congatec will be at Shanghai CIIF , the most influential international industry brand exhibition in China. It attracts over 2,602 exhibitors and 178,000 visitors for showcasing the latest embedded technology. You are invited to meet congatec on booth 6.1H A112 at National Exhibition and Convention Center (Shanghai) 

congatec will be showing its complete line of embedded computer modules, single board computers (SBCs) , embedded designs and IoT platforms.

Product highlights:

  • First COM Express Type 7 module based on AMD EPYC 3000 embedded processors
  • Complete AMD EPYC™ eco system with scalable performance coolings and carriers
  • Boards and COM modules based on new 8th Generation Intel® Core™ Mobile processors (codenamed Whiskey Lake)
  • First 3.5” Juke Single Board Computer (SBC)
  • AI vision application for small and size-sensitive devices in harsh environment
  • Intel Coffee Lake-H refresh processor on COM Express Type 6
  • Qseven and SMARC modulles based on NXP i.MX8 / X processors



COM Express Basic Type 7 Server Class module based on AMD EPYC™ 3000 processor series



Highest Performance 3.5'' Single Board Computer based on 8th Generation Intel® Core™ processor series called "Whiskey Lake"


SMARC 2.0 module based on Ultra Low Power NXP i.MX8-X series


COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family