congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core™ processor for IoT. Featuring 11th Gen Intel^® Core™ vPro^®, Intel^® Xeon^® W-11000E, and Intel^® Celeron^® processors, the new modules target the most demanding IoT gateway and edge computing applications.

The conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm) will be available with new scalable 11th Gen Intel Core, Xeon and Celeron processors, with selected variants even for extreme temperatures ranging from -40 to +85°C. Both form factors support up to 128 GB DDR4 SO-DIMM memory with 3200 MT/s and optional ECC. To connect peripherals with massive bandwidth the COM-HPC modules support 20 PCIe Gen 4 lanes (x16 and x4), and the COM Express versions support 16 PCIe lanes. In addition, designers can leverage 20 PCIe Gen 3 lanes with COM-HPC, and 8 PCIe Gen 3 lanes on COM Express.

To support ultra-fast NVMe SSD, the COM-HPC module provides 1x PCIe x4 interface to the carrier board. The COM Express board has NVMe SSD even onboard for optimum utilization of all native Gen 4 lanes supported by the new processor. Further storage media can be connected via 2x SATA Gen 3 on COM-HPC, and 4x SATA on COM Express.