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conga-SMX8X

SMARC 2.0 module based on Ultra Low Power NXP i.MX8-X series

Ausgewählte Produktvariante

    Ausgewählte Ecosystem Parts

    Cooling Solutions

      Carrierboards

        Module services

          Zusätzliche Ecosystem Parts

          Cooling Solutions

          Carrierboards

          Module services

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          conga-SMX8X

          SMARC 2.0 module based on Ultra Low Power NXP i.MX8-X series

          Learn all about COMs - download the guide

          • NXP i.MX8-X ARM Cortex-A35 and Cortex-M4F
          • Ultra Low Power 2-5W
          • Industrial grade, improved Reliability and Virtualization
          • 3D Graphics up to two independent HD displays
          • MIPI CSI-2 camera interface
          Congatec Logo
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          Zusätzliche Ecosystem Parts

          Cooling Solutions

          Carrierboards

          Module services

          Spezifikation

          Formfactor
          SMARC
          CPU
          NXP i.MX8 QuadXPlus – 4, ARM Cortex-A35, 1x ARM Cortex-M4F, 4W
          DRAM
          Up to 4 GByte onboard LPDDR4 memory | 2400 MT/s
          Ethernet
          2 x Gigabit Ethernet
          I/O Interfaces
          5 x USB 2.0 (shared with 1x USB OTG client)
          GPIOs
          2 x FlexCAN
          up to 4x UART (2x with Handshake (1x shared with FlexCAN)
          USB 2.0
          1 x eSPI
          1 x SPI
          I²C bus
          1 x PCI Express™ 3.0 lanes
          1 x SDIO 3.0
          1 x USB 3.0
          optional M.2 1216 WiFi module (soldered down)
          Graphics
          Integrated in NXP i.MX8-X Series single GT7000Lite multimedia GPU
          VPU up to 4K h.265 dec / 1080p h.264 enc/dec) | 3D Graphics with up to 4 high performance vec4 shaders and 16 execution units up to 2 independent displays | OpenGL ES 3.1 | Vulcan VX extensions | OpenCL 1.2 EP | OpenVG 1.1i
          Security
          High Assurance Boot support | Inline Encryption Engine (AES-128) TNG, AES-128, AES-256, 3DES, ARC4, RSA4096, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 4096
          Operating Systems
          Android
          Linux
          Yocto
          Video Interfaces
          1 x dual channel or 2x single channel LVDS 24 bit | 2x MIPI-DSI with 4-lanes shared with LVDS | 1x MIPI-CSI 4-lanes
          Size
          82 x 50 mm (3,23” x 1,97”)

          Dokumente

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          Data Sheet
          Data Sheet for conga-SMX8X 11.11.2026
          Manual
          User's Guide for conga-SMX8X 03.02.2025
          conga-SMX8X software Documentation
          Whitepaper
          The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

          Software

          Android
          Link
          In order to fetch and build the Android-BSP for conga-SMX8-X, please follow:
          https://wiki.congatec.com/wiki/Android_11_conga-SMX8-X
          yocto
          Link
          In order to fetch and build the Yocto for conga-SMX8-X, please follow:
          https://wiki.congatec.com/wiki/Yocto_4.0_conga-SMX8-X

          Produktvarianten

          Part Numbers gefunden

          conga-SMX8-X/i-QXP-4G eMMC16 (P/N 051110)

          SMARC 2.0 module ultra low power NXP i.MX8 QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range.

          conga-SMX8-X/i-QXP-2G eMMC16 (P/N 051113)

          SMARC 2.0 module with ultra low-power NXP i.MX8-X QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range.

          Ecosystem Details

          Cooling Solutions

          conga-SMX8-X/i-CSP-B (P/N 051150)

          Passive cooling solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.

          conga-SMX8-X/i-HSP-B (P/N 051151)

          Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.

          Carrierboards

          conga-SEVAL (P/N 007010)

          Evaluation Carrier Board for SMARC 2.0 modules.

          conga-SMC1/SMARC-ARM (P/N 020750)

          Compact sized SMARC 2.0 Carrier Board for ARM based SMARC Modules

          Module services

          Design-In Training (P/N 27000001)

          Design-Training to develop carrier boards for Computer on Modules

          Conformal Coating Qseven, SMARC, Type 10 (P/N )

          HumiSeal® 1A33 coating for Qseven, SMARC and Type 10 modules; MIL-I-46058C qualified, IPC-CC-830 and RoHS
          Directive 2002/95/EC compliant and recognized under UL File Number E105698.

          Ext. temperature screening (-40°C to +85°C) (P/N )

          congatec Wide Temperature Range Screening
          Standard screening profile with 12h temperature screening and cold soak test
          Including functional test and several boot-ups (before & after screening)

          Ext. temperature screening (-25°C to +80°C) (P/N )

          congatec Wide Temperature Range Screening
          Standard screening profile with 12h temperature screening and cold soak test
          Including functional test and several boot-ups (before & after screening)

          Zubehör

          Mehr über conga-SEVAL

          conga-SEVAL

          Evaluation Carrier Board compatible with SMARC modules

          Details
          Mehr über conga-SMC1/SMARC-ARM

          conga-SMC1/SMARC-ARM

          Compact sized Carrier Board for ARM based SMARC 2.0 modules

          Details

          Was bedeutet aReady.COM?

          aReady.COM is congatec’s pre-validated and pre-configured platform that combines modular hardware and software building blocks to accelerate embedded development. It includes Computer-on-Modules, virtualization by Hypervisor, and pre-installed, licensed OS like ctrlX OS or Ubuntu Pro. Whether for edge computing or IIoT, aReady.COM simplifies integration, enhances security, and shortens time to market.


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