conga-QMX8-Plus computer-on-module
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conga-QMX8-Plus computer-on-module

conga-QMX8-Plus

Qseven module based on NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU

Ausgewählte Modulvariante

Zusätzliche Ecosystem Parts


Cooling solutions

Carrierboards

Module services

conga-QMX8-Plus

Qseven module based on NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU

  • NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU
  • Enhanced AI, Machine Learning and Vision capabilities featuring NPU and integrated camera ISP’s
  • Ultra low power architecture with 2-5W
  • Extended longevity up to 15 years
  • Temperature range up to -40°C .. +85°C
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Zusätzliche Ecosystem Parts

Cooling solutions

Carrierboards

Module services

Spezifikation

Formfactor
Qseven
CPU
NXP i.MX 8M Plus (consumer) (4x ARM® Cortex®-A53 @1.8GHz +1x ARM® Cortex®-M7 + NPU)
NXP i.MX 8M Plus (industrial) (4x ARM® Cortex®-A53 @1.6GHz +1x ARM® Cortex®-M7 + NPU)
DRAM
Up to 6 GByte onboard LPDDR4 memory | 4000 MT/s | inline ECC
Ethernet
1 x Gbit Ethernet with IEEE 1588 and TSN Support
I/O Interfaces
1 x dual-role USB 3.0
1 x CAN FD
1 x UART with Handshake
1 x SPI
2 x I²C bus
1 x PCIe 3.0
1 x onboard µSD card socket
1 x SDIO 3.0
3 x USB 2.0
12 x GPIOs
Mass storage
eMMC 5.1 up to 128 GByte | SPI NOR Flash up to 64MByte
Graphics
Integrated in SoC | GC7000UL 3D graphics with 2 high performance vec4 shaders | GC520L 2D graphics VPU up to 1080p60 H.265/H.264 decoding and encoding | OpenGL ES 3.1 | Vulcan | OpenCL 1.2 FP | OpenVG 1.1 2 independent displays
Security
Cryptographic Acceleration and Assurance Module (CAAM) | Resource Domain Controller | ARM® TrustZone® High Assurance Boot support | SHE, Encryption Engine AES-128, AES-256, 3DES, RC4, RSA4096, TRNG SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 40
Operating Systems
Linux
Yocto
Android
Temperature
Operating Temperature Range: 0 to +60°C commercial grade | -40 to +85°C industrial grade
Storage Temperature Range: -40 to +85°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
1 x dual channel 24-bit LVDS | 1x HDMI 2.0a | 1x MIPI-DSI 4-lane shared with second LVDS channel
2 x MIPI-CSI 4-lane onboard connectors | 2x integrated Image Signal Processor (ISP) for cameras with up to 12 MP resolution
Size
70 x 70 mm (2,75" x 2,75")

Dokumente

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Produktvarianten

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    conga-QMX8-Plus/QC-NPU-4G eMMC16 (P/N 016600)

    Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.8GHz +1x ARM® Cortex®-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range from 0°C to 60°C.

    conga-QMX8-Plus/QC-NPU-2G eMMC16 (P/N 016601)

    Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.8GHz +1x ARM® Cortex®-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range from 0°C to 60°C.

    conga-QMX8-Plus/i-QC-NPU-4G eMMC16 (P/N 016620)

    Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.6GHz +1x ARM® Cortex®-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.

    conga-QMX8-Plus/i-QC-NPU-2G eMMC16 (P/N 016621)

    Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.6GHz +1x ARM® Cortex®-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.

    Ecosystem Details

    Cooling solutions

    conga-QMX8-Plus/HSP-T (P/N 016650)

    Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are 2.5mm thread.

    conga-QMX8-Plus/HSP-B (P/N 016651)

    Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

    Carrierboards

    conga-QEVAL/Qseven 2.0 ARM (P/N 007005)

    Evaluation carrier board for Qseven 2.0 modules based on ARM architecture.

    Module services

    Design-In Training (P/N 27000001)

    Design-Training to develop carrier boards for Computer on Modules

    Conformal Coating Qseven, SMARC, Type 10 (P/N )

    HumiSeal® 1A33 coating for Qseven, SMARC and Type 10 modules; MIL-I-46058C qualified, IPC-CC-830 and RoHS
    Directive 2002/95/EC compliant and recognized under UL File Number E105698.

    Ext. temperature screening (-40°C to +85°C) (P/N )

    congatec Wide Temperature Range Screening
    Standard screening profile with 12h temperature screening and cold soak test
    Including functional test and several boot-ups (before & after screening)

    Ext. temperature screening (-25°C to +80°C) (P/N )

    congatec Wide Temperature Range Screening
    Standard screening profile with 12h temperature screening and cold soak test
    Including functional test and several boot-ups (before & after screening)

    Zubehör

    Mehr über conga-QEVAL/Qseven 2.0

    conga-QEVAL/Qseven 2.0

    To achieve a quick start with Qseven congatec offers an evaluation carrier board, which routes all the Qseven® signals to standard interface connectors.

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