Unser hauseigener Hypervisor ist auf allen neuen x86-basierten Computer-on-Modules von congatec standardmäßig vorinstalliert. Die unten aufgeführten Module sind sofort einsatzbereit – mit nur wenigen Klicks lässt sich eine Testlizenz aktivieren, um die Vorteile der Virtualisierung kostenlos zu testen. Egal ob Sie Workloads konsolidieren, mehrere Betriebssysteme parallel ausführen oder Ihre Edge-Systemarchitektur optimieren möchten – unser Hypervisor ermöglicht Ihnen einen einfachen Einstieg in die Virtualisierung, ganz ohne Integrationsaufwand.
COM-HPC
conga-HPC/cRX1
- AMD Ryzen™ AI Embedded X100
- TDP Range from 45W to 120W
- NPU with 50 TOPS
- Up to 128 GB LPDDR5x
- Industrial Temp. Range
conga-HPC/cPTL
- Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
- Up to 16 CPU cores
- Integrated NPU with up to 50 TOPS
- Up to 96 GB LPDDR5x memory
- Up to PCI Express Gen5
conga-HPC/mPTL
- Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
- Up to 16 CPU cores
- Integrated NPU with up to 50 TOPS
- Up to 96 GB LPDDR5x
- Industrial temperature range
conga-HPC/mIQ-X
- Qualcomm® Dragonwing IQ-X processors
- Up to 12 Oryon™ CPU cores
- Hexagon™ NPU with 45 TOPS
- Up to 64 GB LPDDR5x
- Industrial Temp. Range
conga-sdIL
- Intel® Xeon® D-1700 / D-1800 processors
- Up to 10 cores
- Up to 64GB soldered RAM | ECC support
- Ext. temp. options
- 100 Gb max. Ethernet bandwidth
conga-HPC/cBLS
- 13th Gen Intel® Core™ 2xx series processors (Bartlett Lake-S)
- Up to 24 CPU cores
- AI acceleration with Intel® Deep Learning Boost (VNNI)
- Up to 192 GB DDR5 memory
- PCI Express Gen 5 and USB 3.2 Gen 2x2
conga-HPC/sILH
- Intel® Xeon® D2700 processors
- Up to 20 cores
- Up to 1 TB RAM
- Ext. temp. options
- 100 Gb max. Ethernet bandwidth
conga-HPC/sILL
- Intel® Xeon® D1700 processors
- Up to 10 cores
- Up to 256 GB RAM
- Ext. temp. options
- 100 Gb max. Ethernet bandwidth
conga-HPC/cRLP
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
conga-HPC/cRLS
- 13th/14th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
conga-HPC/cTLH
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/cTLU
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/mRLP
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
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COM Express
conga-TC300
- Intel® Core™ Series 3 processors
- Up to 6 CPU cores
- Optional integrated NPU with up to 18 TOPS
- Up to 64 GB DDR5 memory
conga-TCRP1
- AMD Zen5/5c CPU Cores
- AMD Radeon™ RDNA™ 3.5 Graphics
- AMD XDNA™ 2 NPU
- TDP Range from 15W to 54W
- Onboard NVMe™ SSD (option)
conga-TC1000r
- Intel® Core™ Ultra processors (Series 3)
- Up to 16 cores and 22 threads
- Intel® Arc™ Graphics Xᵉ3 up to 192 EU
- Integrated NPU with 50 TOPS, 180 TOPS total platform performance
- LPDDR5x memory with up to 96 GB RAM system capacity
conga-TC1000
- Intel® Core™ Ultra processors (Series 3)
- Up to 16 cores and 22 threads
- Intel® Arc™ Graphics Xᵉ3 up to 192 EU
- Integrated NPU with 50 TOPS, 180 TOPS total platform performance
- Up to 128 GB DDR5 SODIMM
conga-TC750
- Intel® Core™ Ultra processors
- Intel® Arc™ Graphics with up to 128 EUs
- Up to 99 TOPS Edge AI performance
- Up to 128 GB RAM with in-band ECC
- Up to 16 cores / 22 threads
- PCIe Gen 4 & USB 4
conga-TCR8
- AMD Ryzen Embedded 8000
- Up to 8 Zen 4 cores
- AMD Radeon™ RDNA™ 3 Graphics
- AMD XDNA™ NPU
- Up to 96 GB RAM (optional with ECC)
- TDP Range from 15W to 54W
- Onboard NVMe™ SSD (option)
conga-bRP6
- 13th Generation Intel® Core™ Processors
- Up to 64 GByte DDR5 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
conga-TC700
- Intel® Core™ Ultra processors
- Up to 16 cores
- Up to 96 GB DDR5 with in-band ECC
- Built-in Intel® Arc™ GPU
- Integrated Intel® AI Boost NPU
conga-TC675r
- 13th Generation Intel® Core™
- Soldered memory
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
conga-TC675
- 13th Generation Intel® Core™
- Intel® Performance Hybrid Architecture
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
conga-TS570
- 11th Generation Intel® Core™
- Performance-optimized design
- Up to 8 cores
- Extended temperature range options
- PCIe Gen 4
conga-TC570r
- 11th Generation Intel® Core™
- Extremely rugged with soldered memory
- Extended temperature range options
- IEC-60068 certified
- PCIe Gen 4
conga-TC570
- 11th Generation Intel® Core™
- Compact design
- Up to 4 cores
- Extended temperature range options
- PCIe Gen 4
conga-TCA7
- Intel Atom® x6000E, Intel® Pentium® and Celeron®
- Cost- and power-optimized design
- Up to 4 cores
- Extended temperature range options
- Supports TSN and TCC
conga-TCV2
- AMD Embedded Ryzen V2000 processor series
- High-performance Zen 2 CPU & VEGA GPU
- Superior cost/performance ratio
- Up to 8 cores
- Wide TDP range from 10-54 W
conga-B7XI
- Intel® Xeon® D1700 processors
- Up to 10 cores
- Up to 128 GB RAM
- Extended temperature options
- Up to 4x 10 GbE supporting CEI/KR/SFI
conga-MA7
- Intel Atom®, Intel® Pentium® and Celeron®
- Rugged design with soldered processor and memory
- Real-time capable with TCC and TSN
- Inband ECC memory support
- Extended temperature support
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SMARC / Qseven / Pico ITX
conga-SMX95
- NXP i.MX 95 processor series
- Up to 6-core ARM Cortex-A55
- NXP eIQ® Neutron NPU
- Advanced Security
- Industrial temperature support
conga-SA8
- Intel Atom x7000RE Series
- Up to 8 Cores
- Up to 16 GByte soldered LPDDR5
- Industrial temperature support
- Virtualization ready with Hypervisor
conga-STDA4
- TI processor TDA4VM
- Dual Arm® Cortex®-A72
- Deep learning hardware accelerator
- Arm® Cortex®-R5F MCUs for real-time communication
- Industrial temperature support
conga-sXAS
- Intel Atom® x7000E, x7000RE Series
- Up to 16 GByte LPDDR5 memory down with inband ECC support
- Dual LVDS, HDMI, DP++
- 1x USB 3.2, 6x USB 2.0, eMMC onboard
- Industrial grade temperature
conga-sXEL
- Intel® Atom®, Pentium® and Celeron® processor series
- Up to 16 GByte LPDDR4 memory down with inband ECC support
- 2x USB 3.0, 4x USB 2.0, 1x SATA, eMMC onboard
- TSN support
- Industrial grade temperature
conga-SMX8-Plus
- NXP i.MX 8M Plus application processor
- Integrated Neural Processing Unit (NPU)
- Quadcore Arm® Cortex®-A53 / M7
- Up to 3 independent display outputs
- Industrial temperature support
conga-SA7
- Intel Atom® x6000E, Intel® Pentium® or Celeron® J
- 8 variants for broad scalability
- GbE with TSN and TCC support
- Up to 16 GB LPDDR4x
- Industrial temperature support
conga-QA7
- Intel Atom® x6000E, Intel® Pentium® or Celeron® J
- 8 variants for broad scalability
- GbE with TSN and TCC support
- Up to 16 GB LPDDR4x
- Industrial temperature support
conga-PA7
Pico-ITX SBC based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series
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