Unsere Virtualization-Ready Module

conga-HPC/cPTL

• Intel® performance hybrid design with up to 16 cores
• LPCAMM2 socket for LPDDR5 memory
• Integrated NPU for dedicated AI acceleration
• Up to PCI Express Gen5

conga-HPC/mPTL

• Intel® performance hybrid design with up to 16 cores
• Integrated NPU for dedicated AI acceleration
• Onboard LPDDR5x with in-band ECC on selected
• product variants Onboard NVMe SSD with 128GB

conga-sdID

• Intel Xeon D-2700 / D-2800 Server platform
• Up to 20 cores
• 32x PCIe Gen 4.0
• Max 512GB DDR4-DIMM
• Ext. temp. options

conga-HPC/mIQ-X

• Qualcomm® Dragonwing IQ-X processors
• Up to 12 Oryon™ CPU cores
• Hexagon™ NPU with 45 TOPS
• Up to 64 GB LPDDR5x
• Industrial Temp. Range

conga-sdIL

• Intel® Xeon® D-1700 / D-1800 processors
• Up to 10 cores
• Up to 64GB soldered RAM | ECC support
• Ext. temp. options
• 100 Gb max. Ethernet bandwidth

conga-HPC/cBLS

• Product variants based on Intel® hybrid design and Intel® P-core only
• Up to Intel® UHD Graphics 770 driven by Xe Architecture
• PCI Express Gen 4 and 5 | USB 3.2 Gen 2x2
• AI Acceleration based on Intel® Deep Learning Boost (VNNI) 

conga-HPC/sILH

• Intel® Xeon® D2700 processors
• Up to 20 cores
• Up to 1 TB RAM
• Ext. temp. options
• 100 Gb max. Ethernet bandwidth

conga-HPC/sILL

• Intel® Xeon® D1700 processors
• Up to 10 cores
• Up to 256 GB RAM
• Ext. temp. options
• 100 Gb max. Ethernet bandwidth

conga-HPC/cRLP

• 13th Generation Intel® Core™
• Intel® performance hybrid architecture
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 5

conga-HPC/cRLS

• 13th/14th Generation Intel^® Core™
• Intel^® performance hybrid architecture
• Performance-optimized design
• Up to 24 cores
• PCIe Gen 5

conga-HPC/cTLH

• 11th Generation Intel® Core™
• Intel® Xe graphics engine
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 4

conga-HPC/cTLU​

• 11th Generation Intel® Core™
• Power- and size-optimized design
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 4

conga-HPC/mRLP

• 13th Generation Intel® Core™
• Intel® Xe graphics engine
• Rugged soldered processor
• Industrial temperature support
• PCIe Gen 4

conga-TCRP1

• AMD Zen5/5c CPU Cores
• AMD Radeon™ RDNA™ 3.5 Graphics
• AMD XDNA™ 2 NPU
• TDP Range from 15W to 54W
• Onboard NVMe™ SSD (option)

conga-TC1000r

• Intel® performance hybrid architecture with up to 16 cores
• Intel® Arc™ Graphics or Intel Graphics
• Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance
• LPCAMM2 LPDDR5 memory with up to 96 GB RAM system capacity 

conga-TC1000

• Up to 16 cores and 22 threads
• Intel® Arc™ Graphics Xᵉ3 up to 192 EU
• Integrated NPU with 50 TOPS, 180 TOPS total platform performance
• Up to 128 GB DDR5 SODIMM

conga-TC750

•  Intel® Core™ Ultra processors
• Intel® Arc™ Graphics with up to 128 EUs
• Up to 99 TOPS Edge AI performance
• Up to 128 GB RAM with in-band ECC
• Up to 16 cores / 22 threads
• PCIe Gen 4 & USB 4

conga-TCR8

• AMD Ryzen Embedded 8000
• Up to 8 Zen 4 cores
• AMD Radeon™ RDNA™ 3 Graphics
• AMD XDNA™ NPU
• Up to 96 GB RAM (optional with ECC)
• TDP Range from 15W to 54W
• Onboard NVMe™ SSD (option)

conga-bRP6

• 13th Generation Intel^® Core™ Processors
• Up to 64 GByte DDR5 memory
• Up to 2.5 Gb Ethernet with TSN support
• Optional NVMe SSD onboard
• Industrial grade versions

conga-TC700

• Intel^® Core™ Ultra processors
• Up to 16 cores
• Up to 96 GB DDR5 with in-band ECC
• Built-in Intel^® Arc™ GPU
• Integrated Intel^® AI Boost NPU

conga-TC675r

• 13th Generation Intel® Core™
• Soldered memory
• Extended temperature range options
• Up to 14 cores
• PCIe Gen 4

conga-TC675

• 13th Generation Intel® Core™
• Intel® Performance Hybrid Architecture
• Extended temperature range options
• Up to 14 cores
• PCIe Gen 4

conga-TS570

• 11th Generation Intel® Core™
• Performance-optimized design
• Up to 8 cores
• Extended temperature range options
• PCIe Gen 4

conga-TC570r

• 11th Generation Intel® Core™
• Extremely rugged with soldered memory
• Extended temperature range options
• IEC-60068 certified
• PCIe Gen 4

conga-TC570

• 11th Generation Intel® Core™
• Compact design
• Up to 4 cores
• Extended temperature range options
• PCIe Gen 4

conga-TCA7

• Intel Atom® x6000E, Intel® Pentium® and Celeron®
• Cost- and power-optimized design
• Up to 4 cores
• Extended temperature range options
• Supports TSN and TCC

conga-TCV2

• AMD Embedded Ryzen V2000 processor series
• High-performance Zen 2 CPU & VEGA GPU
• Superior cost/performance ratio
• Up to 8 cores
• Wide TDP range from 10-54 W

conga-B7XI

• Intel® Xeon® D1700 processors
• Up to 10 cores
• Up to 128 GB RAM
• Extended temperature options
• Up to 4x 10 GbE supporting CEI/KR/SFI

conga-MA7

• Intel Atom®, Intel® Pentium® and Celeron®
• Rugged design with soldered processor and memory
• Real-time capable with TCC and TSN
• Inband ECC memory support
• Extended temperature support

conga-SMX95

• NXP i.MX 95 processor series
• Up to 6-core ARM Cortex-A55
• NXP eIQ^® Neutron NPU
• Advanced Security
• Industrial temperature support

conga-SA8

• Intel Atom x7000RE Series
• Up to 8 Cores
• Up to 16 GByte soldered LPDDR5
• Industrial temperature support
• Virtualization ready with Hypervisor

conga-STDA4

• TI processor TDA4VM or DRA829J
• Dual Arm^® Cortex^®-A72
• Deep learning hardware accelerator
• Arm^® Cortex^®-R5F MCUs for real-time communication
• Industrial temperature support

conga-sXAS

• Intel Atom® x7000E, x7000RE Series
• Up to 16 GByte LPDDR5 memory down with inband ECC support
• Dual LVDS, HDMI, DP++
• 1x USB 3.2, 6x USB 2.0, eMMC onboard
• Industrial grade temperature

conga-sXEL

• Intel® Atom®, Pentium® and Celeron® processor series
• Up to 16 GByte LPDDR4 memory down with inband ECC support
• 2x USB 3.0, 4x USB 2.0, 1x SATA, eMMC onboard
• TSN support
• Industrial grade temperature

conga-SMX8-Plus

• NXP i.MX 8M Plus application processor
• Integrated Neural Processing Unit (NPU)
• Quadcore Arm® Cortex®-A53 / M7
• Up to 3 independent display outputs
• Industrial temperature support

conga-SA7

• Intel Atom® x6000E, Intel® Pentium® or Celeron® J
• 8 variants for broad scalability
• GbE with TSN and TCC support
• Up to 16 GB LPDDR4x
• Industrial temperature support

conga-QA7

• Intel Atom® x6000E, Intel® Pentium® or Celeron® J
• 8 variants for broad scalability
• GbE with TSN and TCC support
• Up to 16 GB LPDDR4x
• Industrial temperature support

conga-PA7

Pico-ITX SBC based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series