Rugged Embedded Computing for Mission-Critical Applications

Engineered for long-term reliability in harsh environments

Rugged Computer-on-Modules from congatec are designed for mission-critical applications that have to reliably operate in harsh and demanding environments. They combine high computing performance with extended temperature support, robust mechanical design to withstand shock and vibrations, optimized thermal management, and long-term availability. With these features, they can even replace complex and thus expensive Commercial Off The Shelve (COTS) computing systems.

Our rugged modules support wide operating temperature ranges (typically -40 °C to +85 °C), feature soldered DRAM and soldered SSD storage for maximum resistance against shock, vibration, and thermal stress, and are validated for industrial use cases. Optional conformal coating protects sensitive components against moisture, dust, and corrosive atmospheres.

This makes them ideal for applications exposed to extreme temperatures, mechanical stress, humidity, and continuous operation.

Available in multiple form factors such as COM-HPC, COM Express, SMARC, and Qseven, congatec rugged modules enable scalable system designs across industrial automation, transportation, robotics, medical, communications, aerospace and outdoor embedded systems.

Key ruggedization features include:

  • Extended temperature range operation
  • Soldered DRAM and soldered SSD storage
  • Optional conformal coating
  • Shock and vibration tested designs
  • Long-term availability and lifecycle management
  • Industrial-grade components and validation

With congatec rugged Computer-on-Modules, developers get a reliable embedded computing platform that reduces system risk, simplifies certification, and ensures stable operation over the entire product lifecycle.


Explore Our Rugged Module Portfolio

Mehr über conga-TC1000r

conga-TC1000r

  • Intel® performance hybrid architecture with up to 16 cores
  • Intel® Arc™ Graphics or Intel Graphics
  • Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance
  • LPCAMM2 LPDDR5 memory with up to 96 GB RAM system capacity 
Mehr über conga-HPC/cPTL

conga-HPC/cPTL

  • Intel® performance hybrid design with up to 16 cores
  • LPCAMM2 socket for LPDDR5 memory
  • Integrated NPU for dedicated AI acceleration
  • Up to PCI Express Gen5

Rugged Computing – Key Questions Answered

What is a rugged Computer-on-Module (COM)?

A rugged Computer-on-Module is an industrial-grade embedded computing module designed to operate reliably under harsh environmental and mechanical conditions such as extreme temperatures, shock, vibration, and continuous operation.

Which temperature ranges do rugged modules support?

Typical rugged configurations support extended operating temperatures from -40 °C to +85 °C, depending on module type and component selection.

Why is soldered DRAM important for rugged applications?

Soldered DRAM eliminates socketed memory connections, increasing resistance to shock and vibration and improving long-term reliability in mechanically stressed environments.

Which form factors are available as rugged modules?

Rugged configurations are available across multiple form factors, including COM-HPC, COM Express, SMARC, and Qseven.

Can rugged modules be customized?

Yes. Depending on project requirements, options such as extended temperature components, soldered memory, specific storage configurations, and long-term availability programs can be provided.

How does rugged computing reduce system risk?

Rugged modules improve system reliability, reduce failure rates, minimize maintenance effort, and help ensure stable operation over the entire product lifecycle.


Need a Rugged Solution for your specific Requirements?

Our team supports you with module selection, ruggedization options, and application-specific configurations.

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