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conga-STDA4

SMARC Module based on TI Processors TDA4VM and DRA829J

  • Heterogenous architecture with dual Arm® Cortex®-A72, DSP and accelerators for deep learning and multimedia
  • Arm® Cortex®-R5F MCUs to offload real-time communication
  • Highest reliability for harsh environment applications
  • Industrial temperature range -40°C .. +85°C
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Value adding ecosystem offerings

Cooling solutions

Carrierboards

Module services

Specification

Formfactor
SMARC
CPU
TI DRA829J (2x 2.0GHz ARM Cortex-A72, 6x 1.0GHz ARM Cortex-R5F)
TI TDA4VM (2x 2.0GHz ARM Cortex-A72, 6x 1.0GHz ARM Cortex-R5F)
DRAM
Up to 8 GB onboard LPDDR4x memory | 3733 MT/s | inline ECC
Up to 8 MB of on-chip L3 RAM with ECC and coherency | 512KB on-chip SRAM in MAIN domain, protected by ECC
Ethernet
2x Gbit Ethernet with IEEE 1588 support
I/O Interfaces
1 x dual-role USB 2.0
2 x USB 2.0
2 x USB 3.0
1 x SDIO 3.0
2x PCIe 3.0 x1 + 1x PCIe 3.0 x2 or up to 4x PCIe 3.0 x1 |
2 x GP I²C
2 x SPI
4 x UART (2x with Handshake)
2 x CAN FD
14 x GPIOs
optional full industrial onboard UbloxWiFi/BT module
Mass storage
eMMC 5.1 up to 128 GB configurable as pseudo-SLC
Graphics
Integrated in SoC | Graphics Accelerator 3D GPU PowerVRRogue 8XE GE8430 | up to 1x Ultra-HD or 4x Full-HD 60fps display resolution | Up to 2 independent display outputs | VPU up to 4k60p H.264 encode / Full-HD H.265 decode | OpenGL ES 3.1 | Open VX | Open
Security
Customer programmable root key, up to RSA-4K or ECC-512 | Crypto hardware accelerators, PKA with ECC, AES, SHA, RNG, DES and 3DES | High Assurance Boot support (optional) | SHE, Encryption Engine AES-128, AES-256, TRNG, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1
Operating Systems
Linux
Wind River VxWorks
RTOS
QNX
Temperature
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
1x dual channel 24-bit LVDS | 1x Display Port 1.4 supports up to 3 Full HD 1080p displays via MST | optional 1x MIPI-DSI 4-lane shared with LVDS | 2x MIPI-CSI 4-lanes | 2x integrated Image Signal Processor (ISP) for MIPI-CSI camera
Size
82 x 50 mm (3,23” x 1,97”)

Documents

All documents found on this page are updated without notification. Always check this page forthe latestversion.

Data Sheet

conga-STDA4.pdf
21.06.2023

Product Variants

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      There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
      If you don't find the configuration you require contact your congatec Sales representative for further assistance.
      conga-STDA4/i-DRA829J-2G eMMC32 (P/N 051513)

      SMARC Module based on high-performance industrial TI ARM networking processor DRA829. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F, 2GB onboard LPDDR4x memory and 32GB onboard eMMC.Industrial grade temperature range from -40°C to 85°C

      conga-STDA4/i-DRA829J-4G eMMC32 (P/N 051512)

      SMARC Module based on high-performance industrial TI ARM networking processor DRA829. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F, 4GB onboard LPDDR4x memory and 32GB onboard eMMC.Industrial grade temperature range from -40°C to 85°C.

      conga-STDA4/i-TDA4VM-2G eMMC32 (P/N 051511)

      SMARC Module based on high-performance industrial TI ARM processor TDA4VM Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 2GB onboard LPDDR4x memory and 32GB onboard eMMC.Industrial grade temperature range from -40°C to 85°C.

      conga-STDA4/i-TDA4VM-4G eMMC32 (P/N 051510)

      SMARC Module based on high-performance industrial TI ARM processor TDA4VM. Features 2x ARM Cortex-A72 @ 2.0GHz + 6x ARM Cortex-R5F + 8 TOPS MMA (deep-learning matrix multiply accelerator), 4GB onboard LPDDR4x memory and 32GB onboard eMMC.Industrial grade temperature range from -40°C to 85°C.

      Ecosystem Details

      Cooling solutions

      conga-STDA4/CSP-B (P/N 051550)

      Passive cooling solution for SMARC Module conga-STDA4 based onTI ARM Jacinto 7 ARM processor. All standoffs are with 2.7 mm bore hole.

      conga-STDA4/HSP-B (P/N 051551)

      Standard heats preaderfor SMARC Module conga-STDA4 based onTI ARM Jacinto 7 ARM processor. All standoffs are with 2.7 mm bore hole.

      Carrierboards

      conga-SEVAL (P/N 007010)

      Evaluation Carrier Board for SMARC 2.0 modules.

      conga-SMC1/SMARC-ARM (P/N 020750)

      Compact sized SMARC 2.0 Carrier Board for ARM based SMARC Modules

      Module services

      Design-In Training (P/N 022214)

      Design-Training to develop carrier boards for Computer on Modules

      Conformal Coating Qseven, SMARC, Type 10 (P/N )

      HumiSeal® 1A33 coating for Qseven, SMARC and Type 10 modules; MIL-I-46058C qualified, IPC-CC-830 and RoHS
      Directive 2002/95/EC compliant and recognized under UL File Number E105698.

      Ext. temperature screening (-40°C to +85°C) (P/N )

      congatec Wide Temperature Range Screening
      Standard screening profile with 12h temperature screening and cold soak test
      Including functional test and several boot-ups (before & after screening)

      Ext. temperature screening (-25°C to +80°C) (P/N )

      congatec Wide Temperature Range Screening
      Standard screening profile with 12h temperature screening and cold soak test
      Including functional test and several boot-ups (before & after screening)

      Accessories

      More about conga-SMC1/SMARC-ARM

      conga-SMC1/SMARC-ARM

      Compact sized Carrier Board for ARM based SMARC 2.0 modules

      More about conga-SEVAL

      conga-SEVAL

      Evaluation Carrier Board compatible with SMARC modules